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Solder (; NA: ) is a fusible metal
alloy An alloy is a mixture of chemical elements of which at least one is a metal. Unlike chemical compounds with metallic bases, an alloy will retain all the properties of a metal in the resulting material, such as electrical conductivity, ductili ...
used to create a permanent bond between metal workpieces. Solder is melted in order to wet the parts of the joint, where it adheres to and connects the pieces after cooling. Metals or alloys suitable for use as solder should have a lower melting point than the pieces to be joined. The solder should also be resistant to oxidative and corrosive effects that would degrade the joint over time. Solder used in making electrical connections also needs to have favorable electrical characteristics. Soft solder typically has a melting point range of , and is commonly used in
electronics The field of electronics is a branch of physics and electrical engineering that deals with the emission, behaviour and effects of electrons using electronic devices. Electronics uses active devices to control electron flow by amplification ...
,
plumbing Plumbing is any system that conveys fluids for a wide range of applications. Plumbing uses pipes, valves, plumbing fixtures, tanks, and other apparatuses to convey fluids. Heating and cooling (HVAC), waste removal, and potable water delive ...
, and sheet metal work.
Alloy An alloy is a mixture of chemical elements of which at least one is a metal. Unlike chemical compounds with metallic bases, an alloy will retain all the properties of a metal in the resulting material, such as electrical conductivity, ductili ...
s that melt between are the most commonly used. Soldering performed using alloys with a melting point above is called "hard soldering", "silver soldering", or
brazing Brazing is a metal-joining process in which two or more metal items are joined together by melting and flowing a filler metal into the joint, with the filler metal having a lower melting point than the adjoining metal. Brazing differs from ...
. In specific proportions, some alloys are eutectic — that is, the alloy's
melting Melting, or fusion, is a physical process that results in the phase transition of a substance from a solid to a liquid. This occurs when the internal energy of the solid increases, typically by the application of heat or pressure, which in ...
point is the lowest possible for a mixture of those components, and coincides with the freezing point. Non-eutectic alloys can have markedly different ''
solidus Solidus (Latin for "solid") may refer to: * Solidus (coin), a Roman coin of nearly solid gold * Solidus (punctuation), or slash, a punctuation mark * Solidus (chemistry), the line on a phase diagram below which a substance is completely solid * ...
'' and ''
liquidus The liquidus temperature, TL or Tliq, specifies the temperature above which a material is completely liquid, and the maximum temperature at which crystals can co-exist with the melt in thermodynamic equilibrium. It is mostly used for impure subst ...
'' temperatures, as they have distinct liquid and solid transitions. Non-eutectic mixtures often exist as a paste of solid particles in a melted matrix of the lower-melting phase as they approach high enough temperatures. In electrical work, if the joint is disturbed while in this "pasty" state before it fully solidifies, a poor electrical connection may result; use of eutectic solder reduces this problem. The pasty state of a non-eutectic solder can be exploited in plumbing, as it allows molding of the solder during cooling, e.g. for ensuring watertight joint of pipes, resulting in a so-called "wiped joint". For electrical and electronics work, solder wire is available in a range of thicknesses for hand-soldering (manual soldering is performed using a
soldering iron A soldering iron is a hand tool used in soldering. It supplies heat to melt solder so that it can flow into the joint between two workpieces. A soldering iron is composed of a heated metal tip (the ''bit'') and an insulated handle. Heating ...
or soldering gun), and with cores containing
flux Flux describes any effect that appears to pass or travel (whether it actually moves or not) through a surface or substance. Flux is a concept in applied mathematics and vector calculus which has many applications to physics. For transport ...
. It is also available as a room temperature paste, as a preformed foil shaped to match the workpiece which may be more suited for mechanized
mass-production Mass production, also known as flow production or continuous production, is the production of substantial amounts of standardized products in a constant flow, including and especially on assembly lines. Together with job production and bat ...
, or in small "tabs" that can be wrapped around the joint and melted with a flame where an iron isn't usable or available, as for instance in field repairs. Alloys of lead and tin were commonly used in the past and are still available; they are particularly convenient for hand-soldering. Lead-free solders have been increasing in use due to regulatory requirements plus the health and environmental benefits of avoiding lead-based electronic components. They are almost exclusively used today in consumer electronics. Plumbers often use bars of solder, much thicker than the wire used for electrical applications, and apply flux separately; many plumbing-suitable soldering fluxes are too corrosive (or conductive) to be used in electrical or electronic work.
Jeweler A bench jeweler is an artisan who uses a combination of skills to make and repair jewelry. Some of the more common skills that a bench jeweler might employ include antique restoration, silversmith, Goldsmith, stone setting, engraving, fabrica ...
s often use solder in thin sheets, which they cut into snippets.


Etymology

The word solder comes from the
Middle English Middle English (abbreviated to ME) is a form of the English language that was spoken after the Norman conquest of 1066, until the late 15th century. The English language underwent distinct variations and developments following the Old Englis ...
word , via
Old French Old French (, , ; Modern French: ) was the language spoken in most of the northern half of France from approximately the 8th to the 14th centuries. Rather than a unified language, Old French was a linkage of Romance dialects, mutually intel ...
and , from the
Latin Latin (, or , ) is a classical language belonging to the Italic languages, Italic branch of the Indo-European languages. Latin was originally a dialect spoken in the lower Tiber area (then known as Latium) around present-day Rome, but through ...
, meaning "to make solid".


Composition


Lead-based

Tin-
lead Lead is a chemical element with the symbol Pb (from the Latin ) and atomic number 82. It is a heavy metal that is denser than most common materials. Lead is soft and malleable, and also has a relatively low melting point. When freshly cut, ...
(Sn-Pb) solders, also called ''soft solders'', are commercially available with tin concentrations between 5% and 70% by weight. The greater the tin concentration, the greater the solder’s
tensile In physics, tension is described as the pulling force transmitted axially by the means of a string, a rope, chain, or similar object, or by each end of a rod, truss member, or similar three-dimensional object; tension might also be described a ...
and
shear strength In engineering, shear strength is the strength of a material or component against the type of yield or structural failure when the material or component fails in shear. A shear load is a force that tends to produce a sliding failure on a materi ...
s. Lead mitigates the formation of tin whiskers, though the precise mechanism for this is unknown. Today, many techniques are used to mitigate the problem, including changes to the annealing process (heating and cooling), addition of elements like copper and nickel, and the application of conformal coatings. Alloys commonly used for electrical soldering are 60/40 Sn-Pb, which melts at , and 63/37 Sn-Pb used principally in electrical/electronic work. The latter mixture is a eutectic alloy of these metals, which: # has the lowest melting point () of all the tin-lead alloys; and # the melting point is truly a ''point'' — not a range. In the United States, since 1974, lead is prohibited in solder and flux in plumbing applications for drinking water use, per the Safe Drinking Water Act. Historically, a higher proportion of lead was used, commonly 50/50. This had the advantage of making the alloy solidify more slowly. With the pipes being physically fitted together before soldering, the solder could be wiped over the joint to ensure water tightness. Although lead water pipes were displaced by copper when the significance of
lead poisoning Lead poisoning, also known as plumbism and saturnism, is a type of metal poisoning caused by lead in the body. The brain is the most sensitive. Symptoms may include abdominal pain, constipation, headaches, irritability, memory problems, infertil ...
began to be fully appreciated, lead solder was still used until the 1980s because it was thought that the amount of lead that could leach into water from the solder was negligible from a properly soldered joint. The
electrochemical Electrochemistry is the branch of physical chemistry concerned with the relationship between electrical potential difference, as a measurable and quantitative phenomenon, and identifiable chemical change, with the potential difference as an outc ...
couple of copper and lead promotes corrosion of the lead and tin. Tin, however, is protected by insoluble oxide. Since even small amounts of lead have been found detrimental to health as a potent
neurotoxin Neurotoxins are toxins that are destructive to nerve tissue (causing neurotoxicity). Neurotoxins are an extensive class of exogenous chemical neurological insultsSpencer 2000 that can adversely affect function in both developing and mature nerv ...
, lead in plumbing solder was replaced by
silver Silver is a chemical element with the symbol Ag (from the Latin ', derived from the Proto-Indo-European ''h₂erǵ'': "shiny" or "white") and atomic number 47. A soft, white, lustrous transition metal, it exhibits the highest electrical ...
(food-grade applications) or
antimony Antimony is a chemical element with the symbol Sb (from la, stibium) and atomic number 51. A lustrous gray metalloid, it is found in nature mainly as the sulfide mineral stibnite (Sb2S3). Antimony compounds have been known since ancient ti ...
, with
copper Copper is a chemical element with the symbol Cu (from la, cuprum) and atomic number 29. It is a soft, malleable, and ductile metal with very high thermal and electrical conductivity. A freshly exposed surface of pure copper has a pink ...
often added, and the proportion of tin was increased (see lead-free solder). The addition of tin—more expensive than lead—improves
wetting Wetting is the ability of a liquid to maintain contact with a solid surface, resulting from intermolecular interactions when the two are brought together. This happens in presence of a gaseous phase or another liquid phase not miscible with ...
properties of the alloy; lead itself has poor wetting characteristics. High-tin tin-lead alloys have limited use as the workability range can be provided by a cheaper high-lead alloy. Lead-tin solders readily dissolve
gold Gold is a chemical element with the symbol Au (from la, aurum) and atomic number 79. This makes it one of the higher atomic number elements that occur naturally. It is a bright, slightly orange-yellow, dense, soft, malleable, and ductile ...
plating and form brittle intermetallics. 60/40 Sn-Pb solder oxidizes on the surface, forming a complex 4-layer structure: tin(IV) oxide on the surface, below it a layer of tin(II) oxide with finely dispersed lead, followed by a layer of tin(II) oxide with finely dispersed tin and lead, and the solder alloy itself underneath. Lead, and to some degree tin, as used in solder contains small but significant amounts of
radioisotope A radionuclide (radioactive nuclide, radioisotope or radioactive isotope) is a nuclide that has excess nuclear energy, making it unstable. This excess energy can be used in one of three ways: emitted from the nucleus as gamma radiation; transferr ...
impurities. Radioisotopes undergoing
alpha decay Alpha decay or α-decay is a type of radioactive decay in which an atomic nucleus emits an alpha particle (helium nucleus) and thereby transforms or 'decays' into a different atomic nucleus, with a mass number that is reduced by four and an at ...
are a concern due to their tendency to cause
soft error In electronics and computing, a soft error is a type of error where a signal or datum is wrong. Errors may be caused by a defect, usually understood either to be a mistake in design or construction, or a broken component. A soft error is also a ...
s.
Polonium-210 Polonium-210 (210Po, Po-210, historically radium F) is an isotope of polonium. It undergoes alpha decay to stable 206Pb with a half-life of 138.376 days (about months), the longest half-life of all naturally occurring polonium isotopes. First ...
is especially troublesome; lead-210
beta decay In nuclear physics, beta decay (β-decay) is a type of radioactive decay in which a beta particle (fast energetic electron or positron) is emitted from an atomic nucleus, transforming the original nuclide to an isobar of that nuclide. For ...
s to bismuth-210 which then beta decays to polonium-210, an intense emitter of
alpha particle Alpha particles, also called alpha rays or alpha radiation, consist of two protons and two neutrons bound together into a particle identical to a helium-4 nucleus. They are generally produced in the process of alpha decay, but may also be prod ...
s.
Uranium-238 Uranium-238 (238U or U-238) is the most common isotope of uranium found in nature, with a relative abundance of 99%. Unlike uranium-235, it is non-fissile, which means it cannot sustain a chain reaction in a thermal-neutron reactor. However ...
and thorium-232 are other significant contaminants of alloys of lead.


Lead-free

The
European Union The European Union (EU) is a supranational union, supranational political union, political and economic union of Member state of the European Union, member states that are located primarily in Europe, Europe. The union has a total area of ...
Waste Electrical and Electronic Equipment Directive and
Restriction of Hazardous Substances Directive The Restriction of Hazardous Substances Directive 2002/95/EC (RoHS 1), short for Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment, was adopted in February 2003 by the European Unio ...
were adopted in early 2003 and came into effect on July 1, 2006, restricting the inclusion of lead in most consumer electronics sold in the EU, and having a broad effect on consumer electronics sold worldwide. In the US, manufacturers may receive tax benefits by reducing the use of lead-based solder. Lead-free solders in commercial use may contain tin, copper, silver,
bismuth Bismuth is a chemical element with the symbol Bi and atomic number 83. It is a post-transition metal and one of the pnictogens, with chemical properties resembling its lighter group 15 siblings arsenic and antimony. Elemental bismuth occurs ...
,
indium Indium is a chemical element with the symbol In and atomic number 49. Indium is the softest metal that is not an alkali metal. It is a silvery-white metal that resembles tin in appearance. It is a post-transition metal that makes up 0.21 parts ...
,
zinc Zinc is a chemical element with the symbol Zn and atomic number 30. Zinc is a slightly brittle metal at room temperature and has a shiny-greyish appearance when oxidation is removed. It is the first element in group 12 (IIB) of the periodi ...
,
antimony Antimony is a chemical element with the symbol Sb (from la, stibium) and atomic number 51. A lustrous gray metalloid, it is found in nature mainly as the sulfide mineral stibnite (Sb2S3). Antimony compounds have been known since ancient ti ...
, and traces of other metals. Most lead-free replacements for conventional 60/40 and 63/37 Sn-Pb solder have melting points from 50 to 200 °C higher, though there are also solders with much lower melting points. Lead-free solder typically requires around 2% flux by mass for adequate wetting ability. When lead-free solder is used in wave soldering, a slightly modified solder pot may be desirable (e.g.
titanium Titanium is a chemical element with the symbol Ti and atomic number 22. Found in nature only as an oxide, it can be reduced to produce a lustrous transition metal with a silver color, low density, and high strength, resistant to corrosion i ...
liners or impellers) to reduce maintenance cost due to increased tin-scavenging of high-tin solder. Lead-free solder may be less desirable for critical applications, such as
aerospace Aerospace is a term used to collectively refer to the atmosphere and outer space. Aerospace activity is very diverse, with a multitude of commercial, industrial and military applications. Aerospace engineering consists of aeronautics and ast ...
and medical projects, because its properties are less thoroughly known.
Tin-silver-copper Tin-silver-copper ( Sn- Ag- Cu, also known as SAC), is a lead-free ( Pb-free) alloy commonly used for electronic solder. It is the main choice for lead-free surface-mount technology (SMT) assembly in the industry,Peter BioccaLead-free SMT Soldering ...
(Sn-Ag-Cu, or ''SAC'') solders are used by two-thirds of Japanese manufacturers for reflow and wave soldering, and by about 75% of companies for hand soldering. The widespread use of this popular lead-free solder alloy family is based on the reduced melting point of the Sn-Ag-Cu ternary eutectic behavior (), which is below the 22/78 Sn-Ag (wt.%) eutectic of and the 59/41 Sn-Cu eutectic of . The ternary eutectic behavior of Sn-Ag-Cu and its application for electronics assembly was discovered (and patented) by a team of researchers from Ames Laboratory,
Iowa State University Iowa State University of Science and Technology (Iowa State University, Iowa State, or ISU) is a public land-grant research university in Ames, Iowa. Founded in 1858 as the Iowa Agricultural College and Model Farm, Iowa State became one of th ...
, and from
Sandia National Laboratories Sandia National Laboratories (SNL), also known as Sandia, is one of three research and development laboratories of the United States Department of Energy's National Nuclear Security Administration (NNSA). Headquartered in Kirtland Air Force Bas ...
-Albuquerque. Much recent research has focused on the addition of a fourth element to Sn-Ag-Cu solder, in order to provide compatibility for the reduced cooling rate of solder sphere reflow for assembly of
ball grid array A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be pu ...
s. Examples of these four-element compositions are 18/64/14/4 tin-silver-copper-zinc (Sn-Ag-Cu-Zn) (melting range 217–220 °C) and 18/64/16/2 tin-silver-copper-
manganese Manganese is a chemical element with the Symbol (chemistry), symbol Mn and atomic number 25. It is a hard, brittle, silvery metal, often found in minerals in combination with iron. Manganese is a transition metal with a multifaceted array of ...
(Sn-Ag-Cu-Mn; melting range of 211–215 °C). Tin-based solders readily dissolve gold, forming brittle intermetallic joins; for Sn-Pb alloys the critical concentration of gold to embrittle the joint is about 4%. Indium-rich solders (usually indium-lead) are more suitable for soldering thicker gold layer as the dissolution rate of gold in indium is much slower. Tin-rich solders also readily dissolve silver; for soldering silver metallization or surfaces, alloys with addition of silvers are suitable; tin-free alloys are also a choice, though their wettability is poorer. If the soldering time is long enough to form the intermetallics, the tin surface of a joint soldered to gold is very dull.


Hard solder

Hard solders are used for brazing, and melt at higher temperatures. Alloys of copper with either zinc or silver are the most common. In
silversmithing A silversmith is a metalworker who crafts objects from silver. The terms ''silversmith'' and '' goldsmith'' are not exactly synonyms as the techniques, training, history, and guilds are or were largely the same but the end product may vary g ...
or
jewelry Jewellery ( UK) or jewelry ( U.S.) consists of decorative items worn for personal adornment, such as brooches, rings, necklaces, earrings, pendants, bracelets, and cufflinks. Jewellery may be attached to the body or the clothes. From a w ...
making, special hard solders are used that will pass
assay An assay is an investigative (analytic) procedure in laboratory medicine, mining, pharmacology, environmental biology and molecular biology for qualitatively assessing or quantitatively measuring the presence, amount, or functional activity of ...
. They contain a high proportion of the metal being soldered and lead is not used in these alloys. These solders vary in hardness, designated as "enameling", "hard", "medium" and "easy". Enameling solder has a high melting point, close to that of the material itself, to prevent the joint desoldering during firing in the enameling process. The remaining solder types are used in decreasing order of hardness during the process of making an item, to prevent a previously soldered seam or joint desoldering while additional sites are soldered. Easy solder is also often used for repair work for the same reason. Flux is also used to prevent joints from desoldering. Silver solder is also used in manufacturing to join metal parts that cannot be
welded Welding is a fabrication process that joins materials, usually metals or thermoplastics, by using high heat to melt the parts together and allowing them to cool, causing fusion. Welding is distinct from lower temperature techniques such as braz ...
. The alloys used for these purposes contain a high proportion of silver (up to 40%), and may also contain
cadmium Cadmium is a chemical element with the Symbol (chemistry), symbol Cd and atomic number 48. This soft, silvery-white metal is chemically similar to the two other stable metals in group 12 element, group 12, zinc and mercury (element), mercury. Li ...
.


Alloys

Different elements serve different roles in the solder alloy: *
Antimony Antimony is a chemical element with the symbol Sb (from la, stibium) and atomic number 51. A lustrous gray metalloid, it is found in nature mainly as the sulfide mineral stibnite (Sb2S3). Antimony compounds have been known since ancient ti ...
is added to increase strength without affecting wettability. Prevents tin pest. Should be avoided on zinc, cadmium, or galvanized metals as the resulting joint is brittle. *
Bismuth Bismuth is a chemical element with the symbol Bi and atomic number 83. It is a post-transition metal and one of the pnictogens, with chemical properties resembling its lighter group 15 siblings arsenic and antimony. Elemental bismuth occurs ...
significantly lowers the melting point and improves wettability. In presence of sufficient lead and tin, bismuth forms crystals of with melting point of only 95 °C, which diffuses along the grain boundaries and may cause a joint failure at relatively low temperatures. A high-power part pre-tinned with an alloy of lead can therefore desolder under load when soldered with a bismuth-containing solder. Such joints are also prone to cracking. Alloys with more than 47% Bi expand upon cooling, which may be used to offset thermal expansion mismatch stresses. Retards growth of tin whiskers. Relatively expensive, limited availability. *
Copper Copper is a chemical element with the symbol Cu (from la, cuprum) and atomic number 29. It is a soft, malleable, and ductile metal with very high thermal and electrical conductivity. A freshly exposed surface of pure copper has a pink ...
improves resistance to thermal cycle fatigue, and improves
wetting Wetting is the ability of a liquid to maintain contact with a solid surface, resulting from intermolecular interactions when the two are brought together. This happens in presence of a gaseous phase or another liquid phase not miscible with ...
properties of the molten solder. It also slows down the rate of dissolution of copper from the board and part leads in the liquid solder. Copper in solders forms intermetallic compounds. Supersaturated (by about 1%) solution of copper in tin may be employed to inhibit dissolution of thin-film under-bump metallization of BGA chips, e.g. as . *
Nickel Nickel is a chemical element with symbol Ni and atomic number 28. It is a silvery-white lustrous metal with a slight golden tinge. Nickel is a hard and ductile transition metal. Pure nickel is chemically reactive but large pieces are slow t ...
can be added to the solder alloy to form a supersaturated solution to inhibit dissolution of thin-film under-bump metallization. In tin-copper alloys, small addition of Ni (<0.5 wt%) inhibits the formation of voids and interdiffusion of Cu and Sn elements. Inhibits copper dissolution, even more in synergy with bismuth. Nickel presence stabilizes the copper-tin intermetallics, inhibits growth of pro-eutectic β-tin dendrites (and therefore increases fluidity near the melting point of copper-tin eutectic), promotes shiny bright surface after solidification, inhibits surface cracking at cooling; such alloys are called "nickel-modified" or "nickel-stabilized". Small amounts increase melt fluidity, most at 0.06%. Suboptimal amounts may be used to avoid patent issues. Fluidity reduction increase hole filling and mitigates bridging and icicles. *
Cobalt Cobalt is a chemical element with the symbol Co and atomic number 27. As with nickel, cobalt is found in the Earth's crust only in a chemically combined form, save for small deposits found in alloys of natural meteoric iron. The free element, p ...
is used instead of nickel to avoid patent issues in improving fluidity. Does not stabilize intermetallic growths in solid alloy. *
Indium Indium is a chemical element with the symbol In and atomic number 49. Indium is the softest metal that is not an alkali metal. It is a silvery-white metal that resembles tin in appearance. It is a post-transition metal that makes up 0.21 parts ...
lowers the melting point and improves ductility. In presence of lead it forms a ternary compound that undergoes phase change at 114 °C. Very high cost (several times of silver), low availability. Easily oxidizes, which causes problems for repairs and reworks, especially when oxide-removing flux cannot be used, e.g. during GaAs die attachment. Indium alloys are used for cryogenic applications, and for soldering gold as gold dissolves in indium much less than in tin. Indium can also solder many nonmetals (e.g. glass, mica, alumina, magnesia, titania,
zirconia Zirconium dioxide (), sometimes known as zirconia (not to be confused with zircon), is a white crystalline oxide of zirconium. Its most naturally occurring form, with a monoclinic crystalline structure, is the mineral baddeleyite. A dopant ...
, porcelain, brick, concrete, and marble). Prone to diffusion into semiconductors and cause undesired doping. At elevated temperatures easily diffuses through metals. Low vapor pressure, suitable for use in vacuum systems. Forms brittle intermetallics with gold; indium-rich solders on thick gold are unreliable. Indium-based solders are prone to corrosion, especially in presence of
chloride The chloride ion is the anion (negatively charged ion) Cl−. It is formed when the element chlorine (a halogen) gains an electron or when a compound such as hydrogen chloride is dissolved in water or other polar solvents. Chloride s ...
ions. *
Lead Lead is a chemical element with the symbol Pb (from the Latin ) and atomic number 82. It is a heavy metal that is denser than most common materials. Lead is soft and malleable, and also has a relatively low melting point. When freshly cut, ...
is inexpensive and has suitable properties. Worse wetting than tin. Toxic, being phased out. Retards growth of tin whiskers, inhibits tin pest. Lowers solubility of copper and other metals in tin. *
Silver Silver is a chemical element with the symbol Ag (from the Latin ', derived from the Proto-Indo-European ''h₂erǵ'': "shiny" or "white") and atomic number 47. A soft, white, lustrous transition metal, it exhibits the highest electrical ...
provides mechanical strength, but has worse ductility than lead. In absence of lead, it improves resistance to fatigue from thermal cycles. Using SnAg solders with HASL-SnPb-coated leads forms phase with melting point at 179 °C, which moves to the board-solder interface, solidifies last, and separates from the board. Addition of silver to tin significantly lowers solubility of silver coatings in the tin phase. In eutectic tin-silver (3.5% Ag) alloy and similar alloys (e.g. SAC305) it tends to form platelets of , which, if formed near a high-stress spot, may serve as initiating sites for cracks and cause poor shock and drop performance; silver content needs to be kept below 3% to inhibit such problems.King-Ning Tu (2007) ''Solder Joint Technology – Materials, Properties, and Reliability''. Springer. High ion mobility, tends to migrate and form short circuits at high humidity under DC bias. Promotes corrosion of solder pots, increases dross formation. * Tin is the usual main structural metal of the alloy. It has good strength and wetting. On its own it is prone to tin pest, tin cry, and growth of tin whiskers. Readily dissolves silver, gold and to less but still significant extent many other metals, e.g. copper; this is a particular concern for tin-rich alloys with higher melting points and reflow temperatures. *
Zinc Zinc is a chemical element with the symbol Zn and atomic number 30. Zinc is a slightly brittle metal at room temperature and has a shiny-greyish appearance when oxidation is removed. It is the first element in group 12 (IIB) of the periodi ...
lowers the melting point and is low-cost. However it is highly susceptible to corrosion and oxidation in air, therefore zinc-containing alloys are unsuitable for some purposes, e.g. wave soldering, and zinc-containing solder pastes have shorter shelf life than zinc-free. Can form brittle Cu-Zn intermetallic layers in contact with copper. Readily oxidizes which impairs wetting, requires a suitable flux. *
Germanium Germanium is a chemical element with the symbol Ge and atomic number 32. It is lustrous, hard-brittle, grayish-white and similar in appearance to silicon. It is a metalloid in the carbon group that is chemically similar to its group neighbors ...
in tin-based lead-free solders influences formation of oxides; at below 0.002% it increases formation of oxides. Optimal concentration for suppressing oxidation is at 0.005%. Used in e.g. Sn100C alloy. Patented. *
Rare-earth element The rare-earth elements (REE), also called the rare-earth metals or (in context) rare-earth oxides or sometimes the lanthanides ( yttrium and scandium are usually included as rare earths), are a set of 17 nearly-indistinguishable lustrous silv ...
s, when added in small amounts, refine the matrix structure in tin-copper alloys by segregating impurities at the grain boundaries. However, excessive addition results in the formation of tin whiskers; it also results in spurious rare earth phases, which easily oxidize and deteriorate the solder properties. *
Phosphorus Phosphorus is a chemical element with the symbol P and atomic number 15. Elemental phosphorus exists in two major forms, white phosphorus and red phosphorus, but because it is highly reactive, phosphorus is never found as a free element on Ea ...
is used as antioxidant to inhibit dross formation. Decreases fluidity of tin-copper alloys.


Impurities

Impurities usually enter the solder reservoir by dissolving the metals present in the assemblies being soldered. Dissolving of process equipment is not common as the materials are usually chosen to be insoluble in solder. *
Aluminium Aluminium (aluminum in American and Canadian English) is a chemical element with the symbol Al and atomic number 13. Aluminium has a density lower than those of other common metals, at approximately one third that of steel. It ha ...
 – little solubility, causes sluggishness of solder and dull gritty appearance due to formation of oxides. Addition of antimony to solders forms Al-Sb intermetallics that are segregated into dross. Promotes embrittlement. *
Antimony Antimony is a chemical element with the symbol Sb (from la, stibium) and atomic number 51. A lustrous gray metalloid, it is found in nature mainly as the sulfide mineral stibnite (Sb2S3). Antimony compounds have been known since ancient ti ...
 – added intentionally, up to 0.3% improves wetting, larger amounts slowly degrade wetting. Increases melting point. *
Arsenic Arsenic is a chemical element with the symbol As and atomic number 33. Arsenic occurs in many minerals, usually in combination with sulfur and metals, but also as a pure elemental crystal. Arsenic is a metalloid. It has various allotropes, b ...
 – forms thin intermetallics with adverse effects on mechanical properties, causes dewetting of brass surfaces *
Cadmium Cadmium is a chemical element with the Symbol (chemistry), symbol Cd and atomic number 48. This soft, silvery-white metal is chemically similar to the two other stable metals in group 12 element, group 12, zinc and mercury (element), mercury. Li ...
 – causes sluggishness of solder, forms oxides and tarnishes *
Copper Copper is a chemical element with the symbol Cu (from la, cuprum) and atomic number 29. It is a soft, malleable, and ductile metal with very high thermal and electrical conductivity. A freshly exposed surface of pure copper has a pink ...
 – most common contaminant, forms needle-shaped intermetallics, causes sluggishness of solders, grittiness of alloys, decreased wetting *
Gold Gold is a chemical element with the symbol Au (from la, aurum) and atomic number 79. This makes it one of the higher atomic number elements that occur naturally. It is a bright, slightly orange-yellow, dense, soft, malleable, and ductile ...
 – easily dissolves, forms brittle intermetallics, contamination above 0.5% causes sluggishness and decreases wetting. Lowers melting point of tin-based solders. Higher-tin alloys can absorb more gold without embrittlement. *
Iron Iron () is a chemical element with symbol Fe (from la, ferrum) and atomic number 26. It is a metal that belongs to the first transition series and group 8 of the periodic table. It is, by mass, the most common element on Earth, right in ...
 – forms intermetallics, causes grittiness, but rate of dissolution is very low; readily dissolves in lead-tin above 427 °C. *
Lead Lead is a chemical element with the symbol Pb (from the Latin ) and atomic number 82. It is a heavy metal that is denser than most common materials. Lead is soft and malleable, and also has a relatively low melting point. When freshly cut, ...
 – causes Restriction of Hazardous Substances Directive compliance problems at above 0.1%. *
Nickel Nickel is a chemical element with symbol Ni and atomic number 28. It is a silvery-white lustrous metal with a slight golden tinge. Nickel is a hard and ductile transition metal. Pure nickel is chemically reactive but large pieces are slow t ...
 – causes grittiness, very little solubility in Sn-Pb *
Phosphorus Phosphorus is a chemical element with the symbol P and atomic number 15. Elemental phosphorus exists in two major forms, white phosphorus and red phosphorus, but because it is highly reactive, phosphorus is never found as a free element on Ea ...
 – forms tin and lead phosphides, causes grittiness and dewetting, present in electroless nickel plating *
Silver Silver is a chemical element with the symbol Ag (from the Latin ', derived from the Proto-Indo-European ''h₂erǵ'': "shiny" or "white") and atomic number 47. A soft, white, lustrous transition metal, it exhibits the highest electrical ...
 – often added intentionally, in high amounts forms intermetallics that cause grittiness and formation of pimples on the solder surface, potential for embrittlement *
Sulfur Sulfur (or sulphur in British English) is a chemical element with the symbol S and atomic number 16. It is abundant, multivalent and nonmetallic. Under normal conditions, sulfur atoms form cyclic octatomic molecules with a chemical formul ...
 – forms lead and tin
sulfide Sulfide (British English also sulphide) is an inorganic anion of sulfur with the chemical formula S2− or a compound containing one or more S2− ions. Solutions of sulfide salts are corrosive. ''Sulfide'' also refers to chemical compounds la ...
s, causes dewetting *
Zinc Zinc is a chemical element with the symbol Zn and atomic number 30. Zinc is a slightly brittle metal at room temperature and has a shiny-greyish appearance when oxidation is removed. It is the first element in group 12 (IIB) of the periodi ...
 – in melt forms excessive dross, in solidified joints rapidly oxidizes on the surface; zinc oxide is insoluble in fluxes, impairing repairability; copper and nickel barrier layers may be needed when soldering brass to prevent zinc migration to the surface; potential for embrittlement Board finishes vs wave soldering bath impurities buildup: * HASL, lead-free (Hot Air Level): usually virtually pure tin. Does not contaminate high-tin baths. * HASL, leaded: some lead dissolves into the bath * ENIG (Electroless Nickel Immersion Gold): typically 100-200 microinches of nickel with 3-5 microinches of gold on top. Some gold dissolves into the bath, but limits exceeding buildup is rare. * Immersion silver: typically 10–15 microinches of silver. Some dissolves into the bath, limits exceeding buildup is rare. * Immersion tin: does not contaminate high-tin baths. * OSP (Organic solderability preservative): usually imidazole-class compounds forming a thin layer on the copper surface. Copper readily dissolves in high-tin baths.


Flux

Flux Flux describes any effect that appears to pass or travel (whether it actually moves or not) through a surface or substance. Flux is a concept in applied mathematics and vector calculus which has many applications to physics. For transport ...
is a
reducing agent In chemistry, a reducing agent (also known as a reductant, reducer, or electron donor) is a chemical species that "donates" an electron to an (called the , , , or ). Examples of substances that are commonly reducing agents include the Earth met ...
designed to help reduce (return oxidized metals to their metallic state) metal oxides at the points of contact to improve the electrical connection and mechanical strength. The two principal types of flux are acid flux (sometimes called "active flux"), containing strong acids, used for metal mending and plumbing, and rosin flux (sometimes called "passive flux"), used in electronics. Rosin flux comes in a variety of "activities", corresponding roughly to the speed and effectiveness of the organic acid components of the rosin in dissolving metallic surface oxides, and consequently the corrosiveness of the flux residue. Due to concerns over atmospheric pollution and
hazardous waste Hazardous waste is waste that has substantial or potential threats to public health or the environment. Hazardous waste is a type of dangerous goods. They usually have one or more of the following hazardous traits: ignitability, reactivity, cor ...
disposal, the electronics industry has been gradually shifting from rosin flux to water-soluble flux, which can be removed with
deionized water Purified water is water that has been mechanically filtered or processed to remove impurities and make it suitable for use. Distilled water was, formerly, the most common form of purified water, but, in recent years, water is more frequently pu ...
and
detergent A detergent is a surfactant or a mixture of surfactants with cleansing properties when in dilute solutions. There are a large variety of detergents, a common family being the alkylbenzene sulfonates, which are soap-like compounds that are m ...
, instead of
hydrocarbon In organic chemistry, a hydrocarbon is an organic compound consisting entirely of hydrogen and carbon. Hydrocarbons are examples of group 14 hydrides. Hydrocarbons are generally colourless and hydrophobic, and their odors are usually weak or ...
solvent A solvent (s) (from the Latin '' solvō'', "loosen, untie, solve") is a substance that dissolves a solute, resulting in a solution. A solvent is usually a liquid but can also be a solid, a gas, or a supercritical fluid. Water is a solvent for ...
s. Water soluble fluxes are generally more conductive than traditionally used electrical / electronic fluxes and so have more potential for electrically interacting with a circuit; in general it is important to remove their traces after soldering. Some rosin type flux traces likewise should be removed, and for the same reason. In contrast to using traditional bars or coiled wires of all-metal solder and manually applying flux to the parts being joined, much hand soldering since the mid-20th century has used flux-core solder. This is manufactured as a coiled wire of solder, with one or more continuous bodies of inorganic acid or rosin flux embedded lengthwise inside it. As the solder melts onto the joint, it frees the flux and releases that on it as well.


Operation

The solidifying behavior depends on the alloy composition. Pure metals solidify at a certain temperature, forming crystals of one phase. Eutectic alloys also solidify at a single temperature, all components precipitating simultaneously in so-called coupled growth. Non-eutectic compositions on cooling start to first precipitate the non-eutectic phase; dendrites when it is a metal, large crystals when it is an intermetallic compound. Such a mixture of solid particles in a molten eutectic is referred to as a mushy state. Even a relatively small proportion of solids in the liquid can dramatically lower its fluidity. The temperature of total solidification is the solidus of the alloy, the temperature at which all components are molten is the liquidus. The mushy state is desired where a degree of plasticity is beneficial for creating the joint, allowing filling larger gaps or being wiped over the joint (e.g. when soldering pipes). In hand soldering of electronics it may be detrimental as the joint may appear solidified while it is not yet. Premature handling of such joint then disrupts its internal structure and leads to compromised mechanical integrity.


Intermetallics

Many different intermetallic compounds are formed during solidifying of solders and during their reactions with the soldered surfaces. The intermetallics form distinct phases, usually as inclusions in a ductile solid solution matrix, but also can form the matrix itself with metal inclusions or form crystalline matter with different intermetallics. Intermetallics are often hard and brittle. Finely distributed intermetallics in a ductile matrix yield a hard alloy while coarse structure gives a softer alloy. A range of intermetallics often forms between the metal and the solder, with increasing proportion of the metal; e.g. forming a structure of . Layers of intermetallics can form between the solder and the soldered material. These layers may cause mechanical reliability weakening and brittleness, increased electrical resistance, or electromigration and formation of voids. The gold-tin intermetallics layer is responsible for poor mechanical reliability of tin-soldered gold-plated surfaces where the gold plating did not completely dissolve in the solder. Two processes play a role in a solder joint formation: interaction between the substrate and molten solder, and solid-state growth of intermetallic compounds. The base metal dissolves in the molten solder in an amount depending on its solubility in the solder. The active constituent of the solder reacts with the base metal with a rate dependent on the solubility of the active constituents in the base metal. The solid-state reactions are more complex – the formation of intermetallics can be inhibited by changing the composition of the base metal or the solder alloy, or by using a suitable
barrier layer A diffusion barrier is a thin layer (usually micrometres thick) of metal usually placed between two other metals. It is done to act as a barrier to protect either one of the metals from corrupting the other.. Adhesion of a plated metal layer to it ...
to inhibit diffusion of the metals. Some example interactions include: * Gold and palladium readily dissolve in solders. Copper and nickel tend to form intermetallic layers during normal soldering profiles. Indium forms intermetallics as well. * Indium-gold intermetallics are brittle and occupy about 4 times more volume than the original gold. Bonding wires are especially susceptible to indium attack. Such intermetallic growth, together with thermal cycling, can lead to failure of the bonding wires. * Copper plated with nickel and gold is often used. The thin gold layer facilitates good solderability of nickel as it protects the nickel from oxidation; the layer has to be thin enough to rapidly and completely dissolve so bare nickel is exposed to the solder. * Lead-tin solder layers on copper leads can form copper-tin intermetallic layers; the solder alloy is then locally depleted of tin and form a lead-rich layer. The Sn-Cu intermetallics then can get exposed to oxidation, resulting in impaired solderability. *  – common on solder-copper interface, forms preferentially when excess of tin is available; in presence of nickel, compound can be formed *  – common on solder-copper interface, forms preferentially when excess of copper is available, more thermally stable than , often present when higher-temperature soldering occurred *  – common on solder-nickel interface *  – very slow formation * Sn - at higher concentration of silver (over 3%) in tin forms platelets that can serve as crack initiation sites. *  – β-phase – brittle, forms at excess of tin. Detrimental to properties of tin-based solders to gold-plated layers. *  – forms on the boundary between gold and indium-lead solder, acts as a barrier against further dissolution of gold


Preform

A preform is a pre-made shape of solder specially designed for the application where it is to be used. Many methods are used to manufacture the solder preform, stamping being the most common. The solder preform may include the solder flux needed for the soldering process. This can be an internal flux, inside the solder preform, or external, with the solder preform coated.


Similar substances

Glass solder is used to join
glass Glass is a non- crystalline, often transparent, amorphous solid that has widespread practical, technological, and decorative use in, for example, window panes, tableware, and optics. Glass is most often formed by rapid cooling (quenchin ...
es to other glasses,
ceramic A ceramic is any of the various hard, brittle, heat-resistant and corrosion-resistant materials made by shaping and then firing an inorganic, nonmetallic material, such as clay, at a high temperature. Common examples are earthenware, porcelain, ...
s,
metal A metal (from ancient Greek, Greek μέταλλον ''métallon'', "mine, quarry, metal") is a material that, when freshly prepared, polished, or fractured, shows a lustrous appearance, and conducts electrical resistivity and conductivity, e ...
s,
semiconductor A semiconductor is a material which has an electrical conductivity value falling between that of a conductor, such as copper, and an insulator, such as glass. Its resistivity falls as its temperature rises; metals behave in the opposite way ...
s,
mica Micas ( ) are a group of silicate minerals whose outstanding physical characteristic is that individual mica crystals can easily be split into extremely thin elastic plates. This characteristic is described as perfect basal cleavage. Mica is ...
, and other materials, in a process called
glass frit bonding Glass frit bonding, also referred to as glass soldering or seal glass bonding, describes a wafer bonding technique with an intermediate glass layer. It is a widely used encapsulation technology for surface micro-machined structures, e.g., accele ...
. The glass solder has to flow and wet the soldered surfaces well below the temperature where deformation or degradation of either of the joined materials or nearby structures (e.g., metallization layers on chips or ceramic substrates) occurs. The usual temperature of achieving flowing and wetting is between .


See also

* Body solder * Graping *
Restriction of Hazardous Substances Directive The Restriction of Hazardous Substances Directive 2002/95/EC (RoHS 1), short for Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment, was adopted in February 2003 by the European Unio ...
* Solderability * Solder alloys * Solder mask * Solder fatigue * Wood's metal * Solder paste


References


External links

*{{cite EB1911, wstitle=Solder, volume=25 , page=374 , short=x
Phase diagrams of different types of solder alloys
Fusible alloys Soldering Lead alloys