HOME

TheInfoList



OR:

The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the
socket Socket may refer to: Mechanics * Socket wrench, a type of wrench that uses separate, removable sockets to fit different sizes of nuts and bolts * Socket head screw, a screw (or bolt) with a cylindrical head containing a socket into which the hexag ...
(when a socket is used) rather than the integrated circuit. An LGA can be electrically connected to a printed circuit board (PCB) either by the use of a socket or by
soldering Soldering (; ) is a process in which two or more items are joined by melting and putting a filler metal (solder) into the joint, the filler metal having a lower melting point than the adjoining metal. Unlike welding, soldering does not invol ...
directly to the board.


Description

The ''land grid array'' is a packaging technology with a grid of contacts, 'lands', on the underside of a package. The contacts are to be connected to a grid of contacts on the PCB. Not all rows and columns of the grid need to be used. The contacts can either be made by using an LGA socket, or by using solder paste. The grid elements found in use can be e.g. circular, triangular or other polygonal shapes and might have even different sizes. Grids might sometimes appear like honey comb patterns. Designs are often optimized for factors like contact likeliness despite tolerances, electrical gap to neighboring contacts and for allowing best shapes for counterpart spring contacts including their outgoing electric connectivity to e.g. a backplane PCB. LGA packaging is related to
ball grid array A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put ...
(BGA) and
pin grid array A pin grid array (PGA) is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the package. The pins are commonly spaced 2.54 mm (0.1") a ...
(PGA) packaging. Unlike pin grid arrays, land grid array packages are designed to fit either in a socket, or be soldered down using surface mount technology. PGA packages cannot be soldered down using surface mount technology. In contrast with a BGA, land grid array packages in non socketed configurations have no balls, and use flat contacts which are soldered directly to the PCB. BGA packages, however have balls as their contacts in between the IC and the PCBs. The balls are normally attached to the underside of the IC.


Use in microprocessors

LGA is used as a physical interface for microprocessors of the Intel Pentium, Intel
Xeon Xeon ( ) is a brand of x86 microprocessors designed, manufactured, and marketed by Intel, targeted at the non-consumer workstation, server, and embedded system markets. It was introduced in June 1998. Xeon processors are based on the same arc ...
,
Intel Core Intel Core is a line of streamlined midrange consumer, workstation and enthusiast computer central processing units (CPUs) marketed by Intel Corporation. These processors displaced the existing mid- to high-end Pentium processors at the time ...
and
AMD Advanced Micro Devices, Inc. (AMD) is an American multinational semiconductor company based in Santa Clara, California, that develops computer processors and related technologies for business and consumer markets. While it initially manufact ...
Opteron, Threadripper, Epyc, and newer Ryzen families. Unlike the
pin grid array A pin grid array (PGA) is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the package. The pins are commonly spaced 2.54 mm (0.1") a ...
(PGA) interface found on older
AMD Advanced Micro Devices, Inc. (AMD) is an American multinational semiconductor company based in Santa Clara, California, that develops computer processors and related technologies for business and consumer markets. While it initially manufact ...
and Intel processors, there are no pins on the chip; in place of the pins are pads of bare gold-plated copper that touch protruding pins on the microprocessor's connector on the motherboard. Compared to PGA CPUs, LGA reduces the likelihood of the chip being damaged either before or during installation as there are no pins that can be accidentally bent. By transferring the pins to the motherboard, it is possible to design the socket to physically shield the pins from damage, and the costs of installation damage can be mitigated as motherboards tend to be significantly cheaper than CPUs. While LGA sockets have been in use as early as 1996 by the MIPS R10000, HP PA-8000, and
Sun The Sun is the star at the center of the Solar System. It is a nearly perfect ball of hot plasma, heated to incandescence by nuclear fusion reactions in its core. The Sun radiates this energy mainly as light, ultraviolet, and infrared radi ...
UltraSPARC II The UltraSPARC II, code-named "Blackbird", is a microprocessor implementation of the SPARC V9 instruction set architecture (ISA) developed by Sun Microsystems. Marc Tremblay was the chief architect. Introduced in 1997, it was further developme ...
processors, the interface did not gain mainstream use until Intel introduced their LGA platform, starting with the 5x0 and 6x0 sequence Pentium 4 (Prescott) in 2004. All Pentium D and
Core 2 Intel Core 2 is the processor family encompassing a range of Intel's consumer 64-bit x86-64 single-, dual-, and quad-core microprocessors based on the Core microarchitecture. The single- and dual-core models are single- die, whereas the quad-co ...
desktop processors use
LGA 775 LGA 775 (land grid array 775), also known as Socket T, is an Intel desktop CPU socket. Unlike PGA CPU sockets, such as its predecessor Socket 478, LGA 775 has no socket holes; instead, it has 775 protruding pins which touch contact points on th ...
socket. As of Q1 2006, Intel switched the Xeon server platform to LGA, starting with the 5000-series models.
AMD Advanced Micro Devices, Inc. (AMD) is an American multinational semiconductor company based in Santa Clara, California, that develops computer processors and related technologies for business and consumer markets. While it initially manufact ...
introduced their server LGA platform starting with the 2000-series Opteron in Q2 2006. AMD offered the Athlon 64 FX series on socket 1207FX through ASUS's L1N64-SLI WS motherboards. It was the only desktop LGA solution offered by AMD. The most recent Intel desktop LGA socket is dubbed
LGA 1700 LGA 1700 (Socket V) is a zero insertion force flip-chip land grid array (LGA) socket, compatible with Intel desktop processors Alder Lake and Raptor Lake, which was first released in November 2021. LGA 1700 is designed as a replacement for LGA 1 ...
(Socket H5), which is used with Intel's
Alder Lake Alder Lake is Intel's codename for the 12th generation of Intel Core processors based on a hybrid architecture utilizing Golden Cove performance cores and Gracemont efficient cores. It is fabricated using Intel's Intel 7 process, previous ...
series Core i3, i5, and i7 families, as well as their lower-end Pentium and Celeron families. Their
Skylake-X Skylake is the codename used by Intel for a processor microarchitecture that was launched in August 2015 succeeding the Broadwell microarchitecture. Skylake is a microarchitecture redesign using the same 14 nm manufacturing process tech ...
Core i7 and Core i9 families use the
LGA 2066 LGA 2066, also called ''Socket R4'', is a CPU socket by Intel that debuted with Skylake-X and Kaby Lake-X processors in June 2017. It replaces Intel's LGA 2011-3 (R3) in the performance, high-end desktop and Workstation platforms (based on the X ...
socket. The LGA setup provides higher pin densities, allowing more power contacts and thus a more stable power supply to the chip. AMD introduced its first consumer LGA socket, called
Socket TR4 Socket TR4, also known as ''Socket SP3r2'', is a zero insertion force land grid array (LGA) CPU socket designed by AMD supporting its first- and second-generation Zen-based Ryzen Threadripper desktop processors, launched on August 10, 2017 f ...
(LGA 4094) for its high end desktop platform Ryzen Threadripper processors. This socket is physically identical to their Socket SP3 for their Epyc server CPUs even though SP3 CPUs are not compatible with the desktop X399 chipset and vice versa. The previous AMD server LGA socket was designated Socket G34 (LGA 1944). Like Intel, AMD decided to use LGA sockets for their higher pin densities, as a 1944-pin PGA would simply be too large for most motherboards.


AMD

*
Socket F Socket F is a CPU socket designed by AMD for its Opteron line of CPUs released on August 15, 2006. In 2010 Socket F was replaced by Socket C32 for entry-level servers and Socket G34 for high-end servers. Technical specifications The socket h ...
(LGA 1207) *
Socket C32 Socket C32 is a zero insertion force land grid array CPU socket designed by AMD for their single-CPU and dual-CPU Opteron 4000 series server CPUs. It is the successor to Socket AM3 for single-CPU servers and the successor for Socket F for low ...
(LGA 1207) (replaces
Socket F Socket F is a CPU socket designed by AMD for its Opteron line of CPUs released on August 15, 2006. In 2010 Socket F was replaced by Socket C32 for entry-level servers and Socket G34 for high-end servers. Technical specifications The socket h ...
) * Socket G34 (LGA 1944) * Socket SP3 (LGA 4094) *
Socket TR4 Socket TR4, also known as ''Socket SP3r2'', is a zero insertion force land grid array (LGA) CPU socket designed by AMD supporting its first- and second-generation Zen-based Ryzen Threadripper desktop processors, launched on August 10, 2017 f ...
(LGA 4094) *
Socket sTRX4 Socket sTRX4, also known as Socket SP3r3, is a land grid array (LGA) CPU socket designed by AMD supporting its Zen 2-based Castle Peak Ryzen Threadripper desktop processors, launched on November 25, 2019 for the high-end desktop and workstat ...
(LGA 4094) *
Socket AM5 Socket AM5 (LGA 1718) is a zero insertion force flip-chip land grid array (LGA) CPU socket designed by Advanced Micro Devices, that is used for AMD Ryzen microprocessors starting with the Zen 4 microarchitecture. AM5 replaces the Socket AM4 and ...
(LGA 1718)


Intel

* LGA 771 (Socket J) – Note that Socket 771 is the server counterpart of LGA 775 and with a bus compatible motherboard, an adapter for LGA 775 to LGA 771 can be used to get a
Xeon Xeon ( ) is a brand of x86 microprocessors designed, manufactured, and marketed by Intel, targeted at the non-consumer workstation, server, and embedded system markets. It was introduced in June 1998. Xeon processors are based on the same arc ...
on a consumer motherboard with Socket 775. *
LGA 775 LGA 775 (land grid array 775), also known as Socket T, is an Intel desktop CPU socket. Unlike PGA CPU sockets, such as its predecessor Socket 478, LGA 775 has no socket holes; instead, it has 775 protruding pins which touch contact points on th ...
(Socket T) *
LGA 1366 LGA 1366 (land grid array 1366), also known as Socket B, is an Intel CPU socket. This socket supersedes Intel's LGA 775 (Socket T) in the high-end and performance desktop segments. It also replaces the server-oriented LGA 771 (Socket J) in the e ...
(Socket B) * LGA 1356 (Socket B2) *
LGA 1156 LGA 1156 (land grid array 1156), also known as Socket H or H1, is an Intel desktop CPU socket. Its incompatible successor is LGA 1155. The last processors supporting it ceased production in 2011. LGA 1156, along with LGA 1366, were designed ...
(Socket H) * LGA 1155 (Socket H2) * LGA 1150 (Socket H3) *
LGA 1151 LGA 1151, also known as Socket H4, zero insertion force flip-chip land grid array (LGA) socket for Intel desktop processors which comes in two distinct versions: the first revision which supports both Intel's Skylake and Kaby Lake CPUs, ...
(Socket H4) – note that two discrete revisions of LGA 1151 exist; the first revision is only compatible with Skylake and
Kaby Lake Kaby Lake is Intel's codename for its seventh generation Core microprocessor family announced on August 30, 2016. Like the preceding Skylake, Kaby Lake is produced using a 14 nanometer manufacturing process technology. Breaking with Intel's ...
CPUs while the second revision is only compatible with
Coffee Lake Coffee Lake is Intel's codename for its eighth generation Core microprocessor family, announced on September 25, 2017. It is manufactured using Intel's second 14 nm process node refinement. Desktop Coffee Lake processors introduced i5 and ...
CPUs. * LGA 1200 (Socket H5) *
LGA 1700 LGA 1700 (Socket V) is a zero insertion force flip-chip land grid array (LGA) socket, compatible with Intel desktop processors Alder Lake and Raptor Lake, which was first released in November 2021. LGA 1700 is designed as a replacement for LGA 1 ...
(Socket V0) * LGA 2011 (Socket R) * LGA 2011-3 (Socket R3) – note that LGA 2011-3 is incompatible with LGA 2011 and is used for Haswell-E and Broadwell-E Intel Core i7 extreme processors and the
Intel X99 Intel X99, codenamed "Wellsburg", is a Platform Controller Hub (PCH) designed and manufactured by Intel, targeted at the high-end desktop (HEDT) and enthusiast segments of the Intel product lineup. The X99 chipset supports both Intel Core&n ...
chipset. It does, however have the same pin count and design as LGA 2011. Also used for Xeon E5 processors and Intel C612 chipset. *
LGA 2066 LGA 2066, also called ''Socket R4'', is a CPU socket by Intel that debuted with Skylake-X and Kaby Lake-X processors in June 2017. It replaces Intel's LGA 2011-3 (R3) in the performance, high-end desktop and Workstation platforms (based on the X ...
(Socket R4) – for Intel's X299 Chipset and i5, i7 and i9 X processors from
Skylake-X Skylake is the codename used by Intel for a processor microarchitecture that was launched in August 2015 succeeding the Broadwell microarchitecture. Skylake is a microarchitecture redesign using the same 14 nm manufacturing process tech ...
and
Kaby Lake-X Kaby Lake is Intel's codename for its seventh generation Core microprocessor family announced on August 30, 2016. Like the preceding Skylake, Kaby Lake is produced using a 14 nanometer manufacturing process technology. Breaking with Intel's p ...
lines. There are
Xeon Xeon ( ) is a brand of x86 microprocessors designed, manufactured, and marketed by Intel, targeted at the non-consumer workstation, server, and embedded system markets. It was introduced in June 1998. Xeon processors are based on the same arc ...
s also available for this socket. *
LGA 3647 LGA 3647 is an Intel microprocessor compatible socket used by Xeon Phi x200 ("Knights Landing"), Xeon Phi 72x5 ("Knights Mill"), Skylake-SP, Cascade Lake-SP/AP, and Cascade Lake-W microprocessors. The socket supports a 6-channel memory co ...
(Socket P, also P0 and P1) – two mechanically incompatible versions for different products, 6ch memory * LGA 4189 (Socket P+) - Intel Xeon Scalable (Ice Lake-SP) socket, 8ch memory


See also

*
Chip carrier In electronics, a chip carrier is one of several kinds of surface-mount technology packages for integrated circuits (commonly called "chips"). Connections are made on all four edges of a square package; compared to the internal cavity for mounti ...
*
Dual in-line package In microelectronics, a dual in-line package (DIP or DIL), is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (P ...
(DIP) *
Pin grid array A pin grid array (PGA) is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the package. The pins are commonly spaced 2.54 mm (0.1") a ...
(PGA) *
Ball grid array A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put ...
(BGA)


References


External links


theinquirer.net - Socket F to debut in July 2006techpowerup.com - Two more pictures of Socket F
{{Semiconductor packages Chip carriers