Thin small outline package (TSOP) is a type of surface mount IC package. They are very low-profile (about 1mm) and have tight lead spacing (as low as 0.5mm). They are frequently used for RAM or Flash memory ICs due to their high pin count and small volume. In some applications, they are being supplanted by

ball grid array A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be pu ...

packages which can achieve even higher densities. The prime application for this technology is memory. SRAM, flash memory, FSRAM and E2PROM manufacturers find this package well suited to their end-use products. It answers the needs required by telecom, cellular, memory modules, PC cards (PCMCIA cards), wireless, netbooks and countless other product applications. TSOP is the smallest leaded form factor for flash memory.

History

The TSOP package was developed to fit the reduced package height available in a PCMCIA PC Card.

Physical properties

TSOPs are rectangular in shape and come in two varieties: Type I and Type II. Type I ICs have the pins on the shorter side and Type II have the pins on the longer side. The table below shows basic measurements for common TSOP packages. SiliconFarEast: "TSOP - Thin Small Outline Package"

Type I

Type II

HTSOP

The HTSOP is a TSOP with an exposed pad on the bottom side. The

exposed pad Expose, exposé, or exposed may refer to: News sources * Exposé (journalism), a form of investigative journalism * '' The Exposé'', a British conspiracist website Film and TV Film * ''Exposé'' (film), a 1976 thriller film * ''Exposed'' (1932 ...

will be soldered on the pcb to transfer heat from the package to the pcb.

Similar packages

There are a variety of small form-factor IC carrier available other than TSOPs *

Small-outline integrated circuit A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are general ...

(SOIC) * Plastic small-outline package (PSOP) * Shrink small-outline package (SSOP) * Thin-shrink small outline package (TSSOP)

References

External links

TSOP Package Information
from

Amkor Technology Amkor Technology, Inc. is a semiconductor product packaging and test services provider. The company has been headquartered in Tempe, Arizona, since 2005, when it was moved from West Chester, Pennsylvania. The company was founded in 1968 and, , ha ...

{{Semiconductor packages Chip carriers