Stopping and Range of Ions in Matter (SRIM) is a group of computer programs which calculate interactions between
ions and matter; the core of SRIM is a program called Transport of Ions in Matter (TRIM). SRIM is popular in the
ion implantation
Ion implantation is a low-temperature process by which ions of one element are accelerated into a solid target, thereby changing the target's physical, chemical, or electrical properties. Ion implantation is used in semiconductor device fabrica ...
research and technology community, and also used widely in other branches of
radiation material science
Radiation materials science is a subfield of materials science which studies the interaction of radiation with matter: a broad subject covering many forms of irradiation and of matter.
Main aim of radiation material science
Some of the most pro ...
.
History
SRIM originated in 1980 as a DOS based program then called TRIM.
The DOS version was upgraded until 1998 and is still available for download. It will run on a Unix PC having a DOS emulator. SRIM-2000 requires a computer with any Windows operating system. The program may work with Unix or Macintosh based systems through
Wine
Wine is an alcoholic drink made from Fermentation in winemaking, fermented fruit. Yeast in winemaking, Yeast consumes the sugar in the fruit and converts it to ethanol and carbon dioxide, releasing heat in the process. Wine is most often made f ...
.
The programs were developed by James F. Ziegler and Jochen P. Biersack around 1983
and are being continuously upgraded with the major changes occurring approximately every five years. SRIM is based on a
Monte Carlo simulation method, namely the
binary collision approximation
In condensed-matter physics, the binary collision approximation (BCA) is a heuristic used to more efficiently simulate the penetration depth and defect production by energetic ions (with kinetic energies in the kilo-electronvolt (keV) range or h ...
with a random selection of the impact parameter of the next colliding ion.
Operation
As the input parameters, it needs the ion type and energy (in the range 10 eV – 2 GeV) and the material of one or several target layers. As the output, it lists or plots the three-dimensional distribution of the ions in the solid and its parameters, such as penetration depth, its spread along the ion beam (called straggle) and perpendicular to it, all target atom
cascades in the target are followed in detail; concentration of
vacancies,
sputtering
In physics, sputtering is a phenomenon in which microscopic particles of a solid material are ejected from its surface, after the material is itself bombarded by energetic particles of a plasma or gas. It occurs naturally in outer space, and c ...
rate, ionization, and phonon production in the target material; energy partitioning between the
nuclear and electron losses, energy deposition rate;
The programs are made so they can be interrupted at any time, and then resumed later.
They have an easy-to-use user interface and built-in default parameters for all ions and materials.
Another part of the software allows calculating the
electronic stopping power of any ion in any material (including gaseous
targets) based on an averaging parametrization of a vast range of experimental data.
Those features made SRIM immensely popular. However, it doesn't take account of the crystal structure nor dynamic composition changes in the material that severely limits its usefulness in some cases.
Other approximations of the program include binary collision (i.e. the influence of neighboring atoms is neglected); the material is fully amorphous, i.e. description of
ion channeling effects is not possible, recombination of knocked off atoms (interstitials) with the vacancies, an effect known to be very important in heat spikes in metals, is neglected;
There is no description of defect clustering and irradiation-induced amorphization, even though the former occurs in most materials and the latter is very important in semiconductors.
The electronic stopping power is an averaging fit to a large number of experiments.
and the interatomic potential as a universal form which is an averaging fit to quantum mechanical calculations,
the target atom which reaches the surface can leave the surface (be
sputtered) if it has momentum and energy to pass the surface barrier, which is a simplifying assumption that does not work well e.g. at energies below the surface penetration energy or if chemical effects are present.
The system is layered, i.e. simulation of materials with composition differences in 2D or 3D is not possible.
The
threshold displacement energy
In materials science, the threshold displacement energy () is the minimum kinetic energy that an atom in a solid needs to be permanently displaced from its site in the lattice to a defect position. It is also known as "displacement threshold ene ...
is a step function for each element, even though in reality it is crystal-direction dependent.
See also
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Binary collision approximation
In condensed-matter physics, the binary collision approximation (BCA) is a heuristic used to more efficiently simulate the penetration depth and defect production by energetic ions (with kinetic energies in the kilo-electronvolt (keV) range or h ...
*
Stopping power (particle radiation)
In nuclear and materials physics, stopping power is the retarding force acting on charged particles, typically alpha and beta particles, due to interaction with matter, resulting in loss of particle kinetic energy.
Stopping power is also inter ...
*
Attenuation length
In physics, the attenuation length or absorption length is the distance into a material when the probability has dropped to that a particle has ''not'' been absorbed. Alternatively, if there is a beam of particles incident on the material, t ...
*
Collision cascade
In condensed-matter physics, a collision cascade (also known as a displacement cascade or a displacement spike) is a set of nearby adjacent energetic (much higher than ordinary thermal energies) collisions of atoms induced by an energetic par ...
*
Sputtering
In physics, sputtering is a phenomenon in which microscopic particles of a solid material are ejected from its surface, after the material is itself bombarded by energetic particles of a plasma or gas. It occurs naturally in outer space, and c ...
*
Ion implantation
Ion implantation is a low-temperature process by which ions of one element are accelerated into a solid target, thereby changing the target's physical, chemical, or electrical properties. Ion implantation is used in semiconductor device fabrica ...
Further reading
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References
{{reflist
External links
The web portal of SRIM/TRIM program
Condensed matter physics
Materials science
Nuclear physics