Plasma processing is a plasma-based material processing technology that aims at modifying the chemical and physical properties of a surface. Plasma processing techniques include: *

Plasma activation Plasma activation (or plasma functionalization) is a method of surface modification employing plasma processing, which improves surface adhesion properties of many materials including metals, glass, ceramics, a broad range of polymers and textiles ...

* Plasma ashing *

Plasma cleaning Plasma cleaning is the removal of impurities and contaminants from surfaces through the use of an energetic plasma or dielectric barrier discharge (DBD) plasma created from gaseous species. Gases such as argon and oxygen, as well as mixtures such ...

Plasma electrolytic oxidation Plasma electrolytic oxidation (PEO), also known as electrolytic plasma oxidation (EPO) or microarc oxidation (MAO), is an electrochemical surface treatment process for generating oxide coatings on metals. It is similar to anodizing, but it employs ...

Plasma etching Plasma etching is a form of plasma processing used to fabricate integrated circuits. It involves a high-speed stream of glow discharge ( plasma) of an appropriate gas mixture being shot (in pulses) at a sample. The plasma source, known as etch spec ...

* Plasma functionalization *

Plasma polymerization Plasma polymerization (or glow discharge polymerization) uses plasma sources to generate a gas discharge that provides energy to activate or fragment gaseous or liquid monomer, often containing a vinyl group, in order to initiate polymerization. ...

Corona treatment Corona treatment (sometimes referred to as air plasma) is a surface modification technique that uses a low temperature corona discharge plasma to impart changes in the properties of a surface. The corona plasma is generated by the application of ...

*Plasma modification Related topics are plasma chemistry,

chemical vapor deposition Chemical vapor deposition (CVD) is a vacuum deposition method used to produce high quality, and high-performance, solid materials. The process is often used in the semiconductor industry to produce thin films. In typical CVD, the wafer (subst ...

, and

physical vapor deposition Physical vapor deposition (PVD), sometimes called physical vapor transport (PVT), describes a variety of vacuum deposition methods which can be used to produce thin films and coatings on substrates including metals, ceramics, glass, and polym ...

processes like

sputter deposition Sputter deposition is a physical vapor deposition (PVD) method of thin film deposition by the phenomenon of sputtering. This involves ejecting material from a "target" that is a source onto a "substrate" such as a silicon wafer. Resputtering is ...

, plasma iondoping,

vacuum plasmaspraying Thermal spraying techniques are coating processes in which melted (or heated) materials are sprayed onto a surface. The "feedstock" (coating precursor) is heated by electrical (plasma or arc) or chemical means (combustion flame). Thermal sprayi ...

, and

reactive ion etching Reactive-ion etching (RIE) is an etching technology used in microfabrication. RIE is a type of dry etching which has different characteristics than wet etching. RIE uses chemically reactive plasma to remove material deposited on wafers. The p ...

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