Features overview

CPUs

APUs

Initial platform (2003)

Launched in 2003, the initial platform for mobile AMD processors consists of:

Mobile Sempron

"Dublin" (Socket 754, CG, 130 nm, Desktop replacement)

'' MMX, SSE,

SSE2 SSE2 (Streaming SIMD Extensions 2) is one of the Intel SIMD (Single Instruction, Multiple Data) processor supplementary instruction sets introduced by Intel with the initial version of the Pentium 4 in 2000. SSE2 instructions allow the use of ...

, Enhanced 3DNow!, NX bit''

"Dublin" (Socket 754, CG, 130 nm, Low power)

''MMX, SSE, SSE2, Enhanced 3DNow!, NX bit''

"Georgetown" (Socket 754, D0, 90 nm, Desktop replacement)

''MMX, SSE, SSE2, Enhanced 3DNow!, NX bit''

"Sonora" (Socket 754, D0, 90 nm, Low power)

''MMX, SSE, SSE2, Enhanced 3DNow!, NX bit''

"Albany" (Socket 754, E6, 90 nm, Desktop replacement)

''MMX, SSE, SSE2,

SSE3 SSE3, Streaming SIMD Extensions 3, also known by its Intel code name Prescott New Instructions (PNI), is the third iteration of the SSE instruction set for the IA-32 (x86) architecture. Intel introduced SSE3 in early 2004 with the Prescott revis ...

, Enhanced 3DNow!, NX bit''

"Roma" (Socket 754, E6, 90 nm, Low power)

''MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit''

Mobile Athlon 64

"ClawHammer" (C0 & CG, 130 nm, Desktop replacement)

''MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!''

"ClawHammer" (C0 & CG, 130 nm, 62 W TDP)

''MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!''

"ClawHammer" (CG, 130 nm, 35 W TDP)

''MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!''

"Odessa" (CG, 130 nm, Desktop replacement)

''MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!''

"Odessa" (CG, 130 nm, 35 W TDP)

''MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!''

"Oakville" (D0, 90 nm, 35 W TDP Low Power)

''MMX, SSE, SSE2, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!''

"Newark" (E5, 90 nm, 62 W TDP)

''MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!''

Turion 64

"Lancaster" (90 nm)

''MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!''

Kite platform (2006)

Introduced in 2006, the ''Kite'' platform consists of:

Mobile Sempron

"Keene" (Socket S1, F2, 90 nm, Low power)

''MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!''

Turion 64

"Richmond" (90 nm)

''MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V''

Turion 64 X2

"Taylor" (90 nm)

''MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V''

"Trinidad" (90 nm)

''MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V''

Kite Refresh platform (2007)

AMD used ''Kite Refresh'' as the codenamed for the second-generation AMD mobile platform introduced in February 2007.

Mobile Sempron

"Sherman" (Socket S1, G1 & G2, 65 nm, Low power)

''MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64''

Athlon 64 X2

"Tyler" (65 nm)

''MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V''

Turion 64 X2

"Tyler" (65 nm)

''MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V''

Puma platform (2008)

The ''Puma'' platform introduced in 2008 with June 2008 availability for the third-generation AMD mobile platform consists of:

Mobile Sempron

"Sable" (65 nm)

''MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!''

Athlon X2

"Lion" (65 nm)

''MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V''

Turion X2

"Lion" (65 nm)

''MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V''

Turion X2 Ultra

"Lion" (65 nm)

''MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V''

Yukon platform (2009)

The ''Yukon'' platform was introduced on January 8, 2009, with expected April availability for the first AMD Ultrathin Platform targeting the ultra-portable notebook market.

Sempron

"Huron" (65 nm, Low power)

* Both models support: ''MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64'' * Sempron 210U supports extra AMD-V

Athlon Neo

"Huron" (65 nm, 15 W TDP)

''MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!, AMD-V''

"Sherman" (65 nm, 15 W TDP)

''MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!''

"Congo" (65 nm, 13 W TDP)

''MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!''

Turion

"Congo" (65 nm, 20 W TDP)

''MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64 (AMD's x86-64 implementation), PowerNow!''

Congo platform (2009)

The ''Congo'' platform was introduced in September 2009, as the second AMD Ultrathin Platform targeting the ultra-portable notebook market.

Athlon Neo X2

"Conesus" (65 nm)

''MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, AMD-V''

Turion Neo X2

"Conesus" (65 nm)

''MMX, SSE, SSE2, SSE3, Enhanced 3DNow!, NX bit, AMD64, AMD-V, PowerNow!''

Tigris platform (2009)

The ''Tigris'' platform introduced in September 2009 for the AMD Mainstream Notebook Platform consists of:

Sempron

"Caspian" (45 nm)

Single-core mobile processor ''MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V''

Athlon II

"Caspian" (45 nm)

Dual-core mobile processor ''MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V''

Turion II

"Caspian" (45 nm)

Dual-core mobile processor ''MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V''

Turion II (Ultra)

"Caspian" (45 nm)

Dual-core mobile processor ''MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V''

Nile platform (2010)

The ''Nile'' platform introduced on May 12, 2010, for the third AMD Ultrathin Platform consists of: * ''MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V'' * Memory support: DDR3 SDRAM, DDR3L SDRAM (Up to 1066)

V series

"Geneva" (45 nm)

Single-core mobile processor

Athlon II Neo

"Geneva" (45 nm)

Single-core mobile processor Single-core mobile processor Dual-core mobile processor

Turion II Neo

"Geneva" (45 nm)

Dual-core mobile processor

Danube platform (2010)

The ''Danube'' platform introduced on May 12, 2010, for the AMD Mainstream Notebook Platform consists of: * ''MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V'' * Memory support: DDR3 SDRAM, DDR3L SDRAM (Up to 1066 MHz)

V series

Champlain (45 nm)

Single-core mobile processor

Athlon II

Champlain (45 nm)

Dual-core mobile processor

Turion II

Champlain (45 nm)

Dual-core mobile processor

Phenom II

* ''MMX, SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V'' * Unlike desktop models, mobile Phenom II-based models do not have L3 cache * Memory support: DDR3 SDRAM, DDR3L SDRAM (Up to 1333 MHz)

Champlain (45 nm)

Dual-core mobile processor Triple-core mobile processors Quad-core mobile processors

Brazos platform (2011)

AMD Ultrathin Platform introduced on January 5, 2011, as the fourth AMD mobile platform targeting the ultra-portable notebook market. It features the 40 nm AMD Ontario (a 9-watt AMD APU for netbooks and small form factor desktops and devices) and Zacate (an 18-watt TDP APU for ultrathin, mainstream, and value notebooks as well as desktops and all-in-ones) APUs. Both low-power APU versions feature two Bobcat x86 cores and fully support DirectX11, DirectCompute (

Microsoft Microsoft Corporation is an American multinational corporation and technology company, technology conglomerate headquartered in Redmond, Washington. Founded in 1975, the company became influential in the History of personal computers#The ear ...

programming interface for GPU computing) and

OpenCL OpenCL (Open Computing Language) is a software framework, framework for writing programs that execute across heterogeneous computing, heterogeneous platforms consisting of central processing units (CPUs), graphics processing units (GPUs), di ...

(cross-platform programming interface standard for multi-core x86 and accelerated GPU computing). Both also include UVD dedicated hardware acceleration for HD video including 1080p resolutions. This platform consists of:

"''Ontario''" (40 nm)

* ''SSE, SSE2, SSE3,

SSSE3 Supplemental Streaming SIMD Extensions 3 (SSSE3 or SSE3S) is a SIMD instruction set created by Intel and is the fourth iteration of the SSE technology. History SSSE3 was first introduced with Intel processors based on the Core microarchitect ...

, SSE4a, ABM, NX bit, AMD64, PowerNow!, AMD-V'' * Memory support: DDR3 SDRAM, DDR3L SDRAM (Single-channel, up to 1066 MHz) * 2.5 GT/s UMI. * Config GPU are Unified shaders : Texture mapping units : Render output units * Socket FT1 (BGA-413)

"''Zacate''" (40 nm)

* ''SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, PowerNow!, AMD-V'' * Memory support: DDR3 SDRAM, DDR3L SDRAM (Single-channel, up to 1066 MHz) * 2.5 GT/s UMI. * Config GPU are Unified shaders : Texture mapping units : Render output units * Socket FT1 (BGA-413)

Sabine (Fusion) platform (2011)

The ''Sabine'' platform introduced on June 30, 2011, for the AMD Mainstream Notebook Platform consists of:

"''Llano''" (32 nm)

* ''SSE, SSE2, SSE3, SSE4a, ABM, Enhanced 3DNow!, NX bit, AMD64, PowerNow!, AMD-V, Turbo Core'' * Memory support: 1.35 V DDR3L-1333 memory, in addition to regular 1.5 V

DDR3 Double Data Rate 3 Synchronous Dynamic Random-Access Memory (DDR3 SDRAM) is a type of synchronous dynamic random-access memory (SDRAM) with a high Bandwidth (computing), bandwidth ("double data rate") interface, and has been in use since 2007. ...

memory specified (Dual-channel) * 2.5 GT/s UMI. * Transistors: 1.148 billion * Die size: 228 mm² ¹ Unified shaders : Texture mapping units : Render output units

Brazos 2.0 platform (2012)

AMD Ultrathin Platform introduced on June 6, 2012, as the fourth AMD mobile platform targeting the ultra-portable notebook market. It will feature the 40 nm Zacate (an 18-watt TDP APU for ultrathin, mainstream, and value notebooks as well as desktops and all-in-ones) APUs. This platform consists of:

"''Ontario''", "''Zacate''" (40 nm)

* ''SSE, SSE2, SSE3, SSSE3, SSE4a, ABM, NX bit, AMD64, PowerNow!, AMD-V'' * Single-channel DDR3 SDRAM, DDR3L SDRAM * 2.5 GT/s UMI. * Config GPU are Unified shaders : Texture mapping units : Render output units * Socket FT1 (BGA-413)

Comal (Fusion) platform (2012)

The ''Comal'' platform introduced on May 15, 2012, for the AMD Mainstream Notebook Platform consists of:

"''Trinity''" (2012, 32 nm)

* ''MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, NX bit, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, CVT16, F16C, Turbo Core'' * Memory support: 1.35 V DDR3L-1600 memory, in addition to regular 1.5 V

memory specified (Dual-channel) * 2.5 GT/s UMI. * Transistors: 1.303 billion * Die size: 246 mm² ¹ Config GPU are Unified shaders : Texture mapping units : Render output units

"''Richland''" (2013, 32 nm)

* ''Elite Performance APU''. * ''MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, SSE4a, NX bit, AMD64, AMD-V, AES, CLMUL, AVX, AVX 1.1, XOP, FMA3, FMA4, CVT16, F16C, Turbo Core'' * Memory support: 1.35 V DDR3L-1600 memory, in addition to regular 1.5 V

memory specified (Dual-channel) * 2.5 GT/s UMI. * Transistors: 1.303 billion * Die size: 246 mm² ¹ Config GPU are Unified shaders : Texture mapping units : Render output units

Jaguar (2013)

''"Temash"'' (2013, 28 nm)

Elite Mobility APU: ¹ Unified shaders : Texture mapping units : Render output units

''"Kabini"'' (2013, 28 nm)

Mainstream APU: ¹ Unified shaders : Texture mapping units : Render output units

Puma (2014)

Mullins, Tablet/2-in-1 APU

Beema, Notebook APU

Kaveri (2014)

Carrizo-L (2015)

Carrizo (2015)

Bristol Ridge (2016)

"Raven Ridge" (2017)

"Picasso" (2019)

"Renoir" (2020)

U

H

"Lucienne" (2021)

"Cezanne" (2021)

U

H

"Barceló" (2022)

"Rembrandt" (2022)

Mendocino (7020 series, Zen2/RDNA2 based)

Barcelo-R (7030 series, Zen3/GCN5 based)

Rembrandt-R (7035 series, Zen3+/RDNA2 based)

Phoenix (7040 series, Zen4/RDNA3 based)

Dragon Range (7045 series, Zen4/RDNA2 based)

References

External links

AMD Platforms for Notebook PCs

Compare AMD Notebook Processors

Technical specification AMD products

AMD products and technologies

{{DEFAULTSORT:Amd Mobile Microprocessors AMD Phenom *Phenom