Client Carrier with COM-HPC module for PICMG r7

The computer-on-module for high performance compute (COM-HPC) form factor standard targets high I/O and computer performance levels. Each COM-HPC module integrates core

CPU A central processing unit (CPU), also called a central processor, main processor or just processor, is the electronic circuitry that executes instructions comprising a computer program. The CPU performs basic arithmetic, logic, controlling, and ...

and memory functionality and input and output including USB up to Gen 4, audio ( MIPI SoundWire,

I2S I, or i, is the ninth letter and the third vowel letter of the Latin alphabet, used in the modern English alphabet, the alphabets of other western European languages and others worldwide. Its name in English is ''i'' (pronounced ), plural ...

and DMIC), graphics, (

PCI Express PCI Express (Peripheral Component Interconnect Express), officially abbreviated as PCIe or PCI-e, is a high-speed serial computer expansion bus standard, designed to replace the older PCI, PCI-X and AGP bus standards. It is the common ...

) up to Gen. 5, and Ethernet up to 25 Gbits/s per lane. All I/O signals are mapped to two high density, high speed and low profile connectors on the bottom side of the module. COM-HPC employs a mezzanine-based approach. The COM modules plug into a carrier or base board that is typically customized to the application. Over time, the COM-HPC mezzanine modules can be upgraded to newer, backwards-compatible versions. COM-HPC targets Industrial, Military/Aerospace, Gaming, Medical, Transportation, IoT, and General Computing embedded applications and even scales up to RAM and performance hungry server or edge server applications.

History

The PICMG work-group officially started in October 2018. The hardware specification passed the PICMG member review in December 2020. The official release was expected for January 2021.

Types

There are 2 different pin outs defined in the specification. Note 1: The DC power input for Client Type Modules is defined as wide range 8-20 Volt input.
Note 2: The DC power input for Server Type Modules is defined as 12V only (11.4-12.6 Volt) input.

Size

The specification defines 5 module sizes: The sizes A, B and C are typical Client Type sizes. * Size A: * Size B: * Size C: The larger D and E sizes are typical Server Type sizes to support full size DRAM modules * Size D: * Size E:

Specification

The COM-HPC specification is hosted by PICMG. It is not freely available but may be purchased from the PICMG website. PICMG provides a preview version for free download. The COM-HPC hardware specification will be released Jan 2021. Further COM-HPC related documents will be released in 2021 * Carrier Board Design Guide for Ethernet KR * Full Carrier Board Design Guide * Platform Management Specification * Embedded EEPROM Specification (EEEP)

History

Types

Size

Specification

See also

References

External links