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Multi-leaded Power Package
The multi-leaded power package is a style of electronic component package, commonly used for high power integrated circuits, especially for monolithic audio amplifiers. It was derived from single in-line package. The difference is the lead arrangement; multi-leaded power packages usually have the lead bent to zig-zag pattern. Multi-leaded power packages commonly have more than three leads; nine-, thirteen- and fifteen-lead units are common, units with five or seven leads with TO-220 style are also manufactured. A notable characteristic is a metal tab with a hole, used in mounting the case to a heatsink. The physical view of multi-leaded power packages are simply stretched TO-220 packages. Components made in multi-leaded power packages can handle more power than those constructed in TO-220 cases, or even TO3 cases with thermal resistance no less than 1.5 C/W. One well-known STMicroelectronics brand of this type of package is Multiwatt. Typical applications Multi-leaded power pac ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Integrated Circuit
An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of tiny MOSFETs (metal–oxide–semiconductor field-effect transistors) integrate into a small chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete electronic components. The IC's mass production capability, reliability, and building-block approach to integrated circuit design has ensured the rapid adoption of standardized ICs in place of designs using discrete transistors. ICs are now used in virtually all electronic equipment and have revolutionized the world of electronics. Computers, mobile phones and other home appliances are now inextricable parts of the structure of modern societies, made possible by the small size and low cost of ICs such as modern compute ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Audio Amplifier
An audio power amplifier (or power amp) is an electronic amplifier that amplifies low-power electronic audio signals, such as the signal from a radio receiver or an electric guitar pickup, to a level that is high enough for driving loudspeakers or headphones. Audio power amplifiers are found in all manner of sound systems including sound reinforcement, public address and home audio systems and musical instrument amplifiers like guitar amplifiers. It is the final electronic stage in a typical audio playback chain before the signal is sent to the loudspeakers. The preceding stages in such a chain are low power audio amplifiers which perform tasks like pre-amplification of the signal (this is particularly associated with record turntable signals, microphone signals and electric instrument signals from pickups, such as the electric guitar and electric bass), equalization (e.g., adjusting the bass and treble), tone controls, mixing different input signals or adding electro ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Single In-line Package
In microelectronics, a dual in-line package (DIP or DIL), is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, when the restricted number of leads available on circular transistor-style packages became a limitation in the use of integrated circuits. Increasingly complex circuits required more signal and power supply leads (as observed in Rent's rule); eventually microprocessors and similar complex devices required more leads than could be put on a DIP package, leading to development of higher-density chip carriers. Furthermore, square and rectangular packages made it easier to route printed-circuit traces beneath the packages. A DIP is usually referred to as a DIP''n'', where ''n'' is the total number of pins. For e ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
TO-220
The TO-220 is a style of electronic package used for high-powered, through-hole components with pin spacing. The "TO" designation stands for "transistor outline". TO-220 packages have three leads. Similar packages with two, four, five or seven leads are also manufactured. A notable characteristic is a metal tab with a hole, used to mount the case to a heatsink, allowing the component to dissipate more heat than one constructed in a TO-92 case. Common TO-220-packaged components include discrete semiconductors such as transistors and silicon-controlled rectifiers, as well as integrated circuits. Typical applications The TO-220 package is a "power package" intended for power semiconductors and an example of a through-hole design rather than a surface-mount technology type of package. TO-220 packages can be mounted to a heat sink to dissipate several watts of waste heat. On a so-called "infinite heat sink", this can be 50 W or more. The top of the package has a metal tab ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Heatsink
A heat sink (also commonly spelled heatsink) is a passive heat exchanger that transfers the heat generated by an electronic or a mechanical device to a fluid medium, often air or a liquid coolant, where it is dissipated away from the device, thereby allowing regulation of the device's temperature. In computers, heat sinks are used to cool CPUs, GPUs, and some chipsets and RAM modules. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronics such as lasers and light-emitting diodes (LEDs), where the heat dissipation ability of the component itself is insufficient to moderate its temperature. A heat sink is designed to maximize its surface area in contact with the cooling medium surrounding it, such as the air. Air velocity, choice of material, protrusion design and surface treatment are factors that affect the performance of a heat sink. Heat sink attachment methods and thermal interface materials also affect the die temperatur ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thermal Resistance
Thermal resistance is a heat property and a measurement of a temperature difference by which an object or material resists a heat flow. Thermal resistance is the reciprocal of thermal conductance. * (Absolute) thermal resistance ''R'' in kelvins per watt (K/W) is a property of a particular component. For example, a characteristic of a heat sink. * Specific thermal resistance or thermal resistivity ''Rλ'' in kelvin–metres per watt (K⋅m/W), is a material constant. * Thermal insulance has the units square metre kelvin per watt (m2⋅K/W) in SI units or square foot degree Fahrenheit–hours per British thermal unit (ft2⋅°F⋅h/Btu) in imperial units. It is the thermal resistance of unit area of a material. In terms of insulation, it is measured by the R-value. Absolute thermal resistance Absolute thermal resistance is the temperature difference across a structure when a unit of heat energy flows through it in unit time. It is the reciprocal of thermal conductance. The ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
STMicroelectronics
STMicroelectronics N.V. commonly referred as ST or STMicro is a Dutch multinational corporation and technology company of French-Italian origin headquartered in Plan-les-Ouates near Geneva, Switzerland and listed on the French stock market. ST is the largest European semiconductor contract manufacturing and design company. The company resulted from the merger of two government-owned semiconductor companies in 1987: Thomson Semiconducteurs of France and SGS Microelettronica of Italy. History ST was formed in 1987 by the merger of two government-owned semiconductor companies: Italian SGS Microelettronica (where SGS stands for ''Società Generale Semiconduttori'', "Semiconductors' General Company"), and French Thomson Semiconducteurs, the semiconductor arm of Thomson. SGS Microelettronica originated in 1972 from a previous merger of two companies: * ATES (Aquila Tubi e Semiconduttori), a vacuum tube and semiconductor maker headquartered in L'Aquila, the regional capital of th ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thermal Compound
Thermal paste (also called thermal compound, thermal grease, thermal interface material (TIM), thermal gel, heat paste, heat sink compound, heat sink paste or CPU grease) is a thermally conductive (but usually electrically insulating) chemical compound, which is commonly used as an interface between heat sinks and heat sources such as high-power semiconductor devices. The main role of thermal paste is to eliminate air gaps or spaces (which act as thermal insulation) from the interface area in order to maximize heat transfer and dissipation. Thermal paste is an example of a thermal interface material. As opposed to thermal adhesive, thermal paste does not add mechanical strength to the bond between heat source and heat sink. It has to be coupled with a mechanical fixation mechanism such as screws to hold the heat sink in place and to apply pressure, spreading and thinning the thermal paste. Composition Thermal paste consists of a polymerizable liquid matrix and large vo ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Ground (electricity)
In electrical engineering, ground or earth is a reference point in an electrical circuit from which voltages are measured, a common return path for electric current, or a direct physical connection to the Earth. Electrical circuits may be connected to ground for several reasons. Exposed conductive parts of electrical equipment are connected to ground, to protect users from electrical shock hazard. If internal insulation fails, dangerous voltages may appear on the exposed conductive parts. Connecting exposed parts to ground will allow circuit breakers (or RCDs) to interrupt power supply in the event of a fault. In electric power distribution systems, a protective earth (PE) conductor is an essential part of the safety provided by the earthing system. Connection to ground also limits the build-up of static electricity when handling flammable products or electrostatic-sensitive devices. In some telegraph and power transmission circuits, the ground itself can be used as one ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Mains (electric Power)
Mains electricity or utility power, power grid, domestic power, and wall power, or in some parts of Canada as hydro, is a general-purpose alternating-current (AC) electric power supply. It is the form of electrical power that is delivered to homes and businesses through the electric grid in many parts of the world. People use this electricity to power everyday items—such as domestic appliances, televisions and lamps—by plugging them into a wall outlet. The voltage and frequency of electric power differs between regions. In much of the world, a voltage (nominally) of 230 volts and frequency of 50 Hz is used. In North America, the most common combination is 120 V and a frequency of 60 Hz. Other combinations exist, for example, 230 V at 60 Hz. Travellers' portable appliances may be inoperative or damaged by foreign electrical supplies. Non-interchangeable plugs and sockets in different regions provide some protection from accidental use of appliances ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Mica
Micas ( ) are a group of silicate minerals whose outstanding physical characteristic is that individual mica crystals can easily be split into extremely thin elastic plates. This characteristic is described as perfect basal cleavage. Mica is common in igneous and metamorphic rock and is occasionally found as small flakes in sedimentary rock. It is particularly prominent in many granites, pegmatites, and schists, and "books" (large individual crystals) of mica several feet across have been found in some pegmatites. Micas are used in products such as drywalls, paints, fillers, especially in parts for automobiles, roofing and shingles, as well as in electronics. The mineral is used in cosmetics and food to add "shimmer" or "frost." Properties and structure The mica group is composed of 37 phyllosilicate minerals. All crystallize in the monoclinic system, with a tendency towards pseudohexagonal crystals, and are similar in structure but vary in chemical composition. Micas ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
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