|
Decapping
Decapping (decapsulation) or delidding of an integrated circuit is the process of removing the protective cover or integrated heat spreader (IHS) of an integrated circuit so that the contained die is revealed for visual inspection of the micro circuitry imprinted on the die. This process is typically done in order to debug a manufacturing problem with the chip, or possibly to copy information from the device, to check for counterfeit chips or to reverse engineer it. Companies such as TechInsights and ChipRebel decap, take die shots of, and reverse engineer chips for customers. Modern integrated circuits can be encapsulated in plastic, ceramic, or epoxy packages. Delidding may also be done in an effort to reduce the operating temperatures of an integrated circuit such as a processor, by replacing the thermal interface material (TIM) between the die and the IHS with a higher-quality TIM. With care, it's possible to decap a device and still leave it functional. Method Decapping is ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Integrated Circuit
An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material, usually silicon. Large numbers of tiny MOSFETs (metal–oxide–semiconductor field-effect transistors) integrate into a small chip. This results in circuits that are orders of magnitude smaller, faster, and less expensive than those constructed of discrete electronic components. The IC's mass production capability, reliability, and building-block approach to integrated circuit design has ensured the rapid adoption of standardized ICs in place of designs using discrete transistors. ICs are now used in virtually all electronic equipment and have revolutionized the world of electronics. Computers, mobile phones and other home appliances are now inextricable parts of the structure of modern societies, made possible by the small size and low cost of ICs such as modern compute ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Die (integrated Circuit)
A die, in the context of integrated circuits, is a small block of semiconducting material on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs) through processes such as photolithography. The wafer is cut ( diced) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die. There are three commonly used plural forms: ''dice'', ''dies'' and ''die''. To simplify handling and integration onto a printed circuit board, most dies are packaged in various forms. Manufacturing process Most dies are composed of silicon and used for integrated circuits. The process begins with the production of monocrystalline silicon ingots. These ingots are then sliced into disks with a diameter of up to 300 mm. [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Visual Inspection
Visual inspection is a common method of quality control, data acquisition, and data analysis. Visual Inspection, used in maintenance of facilities, mean inspection of equipment and structures using either or all of raw human senses such as vision, hearing, touch and smell and/or any non-specialized inspection equipment. Inspections requiring Ultrasonic, X-Ray equipment, Infra-red, etc. are not typically regarded as Visual Inspection as these Inspection methodologies require specialized equipment, training and certification. Quality control A study of the visual inspection of small integrated circuits found that the modal duration of eye fixations of trained inspectors was about 200 ms. The most accurate inspectors made the fewest eye fixations and were the fastest. When the same chip was judged more than once by an individual inspector the consistency of judgment was very high whereas the consistency between inspectors was somewhat less. Variation by a factor of six in inspecti ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Ceramic
A ceramic is any of the various hard, brittle, heat-resistant and corrosion-resistant materials made by shaping and then firing an inorganic, nonmetallic material, such as clay, at a high temperature. Common examples are earthenware, porcelain, and brick. The earliest ceramics made by humans were pottery objects (''pots,'' ''vessels or vases'') or figurines made from clay, either by itself or mixed with other materials like silica, hardened and sintered in fire. Later, ceramics were glazed and fired to create smooth, colored surfaces, decreasing porosity through the use of glassy, amorphous ceramic coatings on top of the crystalline ceramic substrates. Ceramics now include domestic, industrial and building products, as well as a wide range of materials developed for use in advanced ceramic engineering, such as in semiconductors. The word "'' ceramic''" comes from the Greek word (), "of pottery" or "for pottery", from (), "potter's clay, tile, pottery". The earliest kno ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Thermal Interface Material
A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them. A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink). At each interface, a thermal boundary resistance exists to impede heat dissipation. In addition, the electronic performance and device lifetime can degrade dramatically under continuous overheating and large thermal stress at the interfaces. Therefore, for the last several decades, there have been intensive efforts in developing various TIMs with the aim of minimizing the thermal boundary resistance between layers and enhancing thermal management performance, as well as tackling application requirements such as low thermal stress between materials of different thermal expansion coefficients, low elastic modulus or viscosity, flexibility, and reusability: *T ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Plasma Etching
Plasma etching is a form of plasma processing used to fabricate integrated circuits. It involves a high-speed stream of glow discharge ( plasma) of an appropriate gas mixture being shot (in pulses) at a sample. The plasma source, known as etch species, can be either charged ( ions) or neutral (atoms and radicals). During the process, the plasma generates volatile etch products at room temperature from the chemical reactions between the elements of the material etched and the reactive species generated by the plasma. Eventually the atoms of the shot element embed themselves at or just below the surface of the target, thus modifying the physical properties of the target. Mechanisms Plasma generation A plasma is a high energetic condition in which a lot of processes can occur. These processes happen because of electrons and atoms. To form the plasma electrons have to be accelerated to gain energy. Highly energetic electrons transfer the energy to atoms by collisions. Three different ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Milling (machining)
Milling is the process of machining using rotary cutters to remove material by advancing a cutter into a workpiece. This may be done by varying direction on one or several axes, cutter head speed, and pressure. Milling covers a wide variety of different operations and machines, on scales from small individual parts to large, heavy-duty gang milling operations. It is one of the most commonly used processes for machining custom parts to precise tolerances. Milling can be done with a wide range of machine tools. The original class of machine tools for milling was the milling machine (often called a mill). After the advent of computer numerical control (CNC) in the 1960s, milling machines evolved into ''machining centers'': milling machines augmented by automatic tool changers, tool magazines or carousels, CNC capability, coolant systems, and enclosures. Milling centers are generally classified as vertical machining centers (VMCs) or horizontal machining centers (HMCs). The integ ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Flip Chip
Flip chip, also known as controlled collapse chip connection or its abbreviation, C4, is a method for interconnecting dies such as semiconductor devices, IC chips, integrated passive devices and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The technique was developed by General Electric's Light Military Electronics Department, Utica, New York. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step. In order to mount the chip to external circuitry (e.g., a circuit board or another chip or wafer), it is flipped over so that its top side faces down, and aligned so that its pads align with matching pads on the external circuit, and then the solder is reflowed to complete the interconnect. This is in contrast to wire bonding, in which the chip is mounted upright and fine wires are welded onto the chip pads and lead frame contacts to interconnect ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Zen 2
Zen 2 is a computer processor microarchitecture by AMD. It is the successor of AMD's Zen and Zen+ microarchitectures, and is fabricated on the 7 nanometer MOSFET node from TSMC. The microarchitecture powers the third generation of Ryzen processors, known as Ryzen 3000 for the mainstream desktop chips (codename "Matisse"), Ryzen 4000U/H (codename "Renoir") and Ryzen 5000U (codename "Lucienne") for mobile applications, as Threadripper 3000 for high-end desktop systems, and as Ryzen 4000G for accelerated processing units (APUs). The Ryzen 3000 series CPUs were released on 7 July 2019, while the Zen 2-based Epyc server CPUs (codename "Rome") were released on 7 August 2019. An additional chip, the Ryzen 9 3950X, was released in November 2019. At CES 2019, AMD showed a Ryzen third-generation engineering sample that contained one chiplet with eight cores and 16 threads. AMD CEO Lisa Su also said to expect more than eight cores in the final lineup. At Computex 2019, AMD revealed tha ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Reverse Engineering
Reverse engineering (also known as backwards engineering or back engineering) is a process or method through which one attempts to understand through deductive reasoning how a previously made device, process, system, or piece of software accomplishes a task with very little (if any) insight into exactly how it does so. It is essentially the process of opening up or dissecting a system to see how it works, in order to duplicate or enhance it. Depending on the system under consideration and the technologies employed, the knowledge gained during reverse engineering can help with repurposing obsolete objects, doing security analysis, or learning how something works. Although the process is specific to the object on which it is being performed, all reverse engineering processes consist of three basic steps: Information extraction, Modeling, and Review. Information extraction refers to the practice of gathering all relevant information for performing the operation. Modeling refers to th ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Sample Preparation Equipment
Sample preparation equipment refers to equipment used for the preparation of physical specimens for subsequent microscopy or related disciplines - including failure analysis and quality control. The equipment includes the following types of machinery: * Precision cross-sectioning saws * Precision lapping & polishing machines * Selected Area Preparation Systems * {{anchor, DecapsulationDecapsulation machinery (using mechanical, chemical/ 'jet etching' acid, laser and plasma methodologies) * Focused ion beam (FIB) systems * Anti-reflective coating An antireflective, antiglare or anti-reflection (AR) coating is a type of optical coating applied to the surface of lenses, other optical elements, and photovoltaic cells to reduce reflection. In typical imaging systems, this improves the ef ... systems * Dimpling equipment * Sputter coating equipment * Carbon and metal evaporation systems Each of these system types incorporates a wealth of accessories and consumable items which f ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
.jpg "Click for more on -> Integrated Circuit")
