|
Wafer Bonding
Wafer bonding is a packaging technology on wafer-level for the fabrication of microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS), microelectronics Microelectronics is a subfield of electronics. As the name suggests, microelectronics relates to the study and manufacture (or microfabrication) of very small electronic designs and components. Usually, but not always, this means micrometre ... and optoelectronics, ensuring a mechanically stable and hermetically sealed encapsulation. The wafers' diameter range from 100 mm to 200 mm (4 inch to 8 inch) for MEMS/NEMS and up to 300 mm (12 inch) for the production of microelectronic devices. Smaller wafers were used in the early days of the microelectronics industry, with wafers being just 1 inch in diameter in the 1950s. Overview In microelectromechanical systems (MEMS) and nanoelectromechanical systems (NEMS), the package protects the sensitive internal structures from environmental infl ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Wafer (electronics)
In electronics, a wafer (also called a slice or substrate) is a thin slice of semiconductor, such as a crystalline silicon (c-Si, silicium), used for Semiconductor device fabrication, the fabrication of integrated circuits and, in photovoltaics, to manufacture solar cells. The wafer serves as the substrate (materials science), substrate for microelectronic devices built in and upon the wafer. It undergoes many microfabrication processes, such as doping (semiconductor), doping, ion implantation, Etching (microfabrication), etching, thin-film deposition of various materials, and Photolithography, photolithographic patterning. Finally, the individual microcircuits are separated by wafer dicing and Integrated circuit packaging, packaged as an integrated circuit. History In the semiconductor industry, the term wafer appeared in the 1950s to describe a thin round slice of semiconductor material, typically germanium or silicon. The round shape characteristic of these wafers comes f ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Adhesive Bonding Of Semiconductor Wafers
Adhesive bonding (also referred to as gluing or glue bonding) describes a wafer bonding technique with applying an intermediate layer to connect substrates of different types of materials. Those connections produced can be soluble or insoluble. The commercially available adhesive can be organic or inorganic and is deposited on one or both substrate surfaces. Adhesives, especially SU-8 and benzocyclobutene (BCB), are specialized for production of MEMS and electronic components. The procedure enables bonding temperatures from 1000 °C down to room temperature. Adhesive bonding has the advantage of relatively low bonding temperature as well as the absence of electric voltage and current. Because the wafers are not in direct contact, this procedure enables the use of different substrates, such as silicon, glass, metals or other semiconductor materials. A drawback is that small structures become wider during patterning which hampers the production of an accurate intermediate la ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Packaging (microfabrication)
Integrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents physical damage and corrosion. The case, known as a " package", supports the electrical contacts which connect the device to a circuit board. The packaging stage is followed by testing of the integrated circuit. Design considerations Electrical The current-carrying traces that run out of the die, through the package, and into the printed circuit board (PCB) have very different electrical properties compared to on-chip signals. They require special design techniques and need much more electric power than signals confined to the chip itself. Therefore, it is important that the materials used as electrical contacts exhibit characteristics like low resistance, low capacitance and low inductance. Both the structure and materials must prioritize signal transmission properties, while minimizing any parasitic elements that co ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Electronics Manufacturing
The electronics industry is the industry that produces electronic devices. It emerged in the 20th century and is today one of the largest global industries. Contemporary society uses a vast array of electronic devices that are built in factories operated by the industry, which are almost always partially automated. Electronic products are primarily assembled from metal–oxide–semiconductor (MOS) transistors and integrated circuits, the latter principally by photolithography and often on printed circuit boards. Circuit boards are assembled largely using surface-mount technology, which typically involves the automated placement of electronic parts on circuit boards using pick-and-place machines. Surface-mount technology and pick-and-place machines make it possible to assemble large numbers of circuit boards at high speed. The industry's size, the use of toxic materials, and the difficulty of recycling have led to a series of problems with electronic waste. International reg ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Wafer Bonding
Wafer bonding is a packaging technology on wafer-level for the fabrication of microelectromechanical systems (MEMS), nanoelectromechanical systems (NEMS), microelectronics Microelectronics is a subfield of electronics. As the name suggests, microelectronics relates to the study and manufacture (or microfabrication) of very small electronic designs and components. Usually, but not always, this means micrometre ... and optoelectronics, ensuring a mechanically stable and hermetically sealed encapsulation. The wafers' diameter range from 100 mm to 200 mm (4 inch to 8 inch) for MEMS/NEMS and up to 300 mm (12 inch) for the production of microelectronic devices. Smaller wafers were used in the early days of the microelectronics industry, with wafers being just 1 inch in diameter in the 1950s. Overview In microelectromechanical systems (MEMS) and nanoelectromechanical systems (NEMS), the package protects the sensitive internal structures from environmental infl ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Bond Characterization
Wafer bond characterization refers to the process of evaluating the quality and strength of a bond between two semiconductor wafers. The wafer bond characterization is based on different methods and tests. Considered a high importance of the wafer are the successful bonded wafers without flaws. Those flaws can be caused by Void (composites), void formation in the interface due to unevenness or Impurity, impurities. The bond connection is characterized for wafer bond development or quality assessment of fabricated wafers and sensors. Overview Wafer bonds are commonly characterized by three important encapsulation parameters: bond strength, Hermetic seal, hermeticity of encapsulation and bonding induced stress. The bond strength can be evaluated using double cantilever beam or chevron respectively micro-chevron tests. Other pull tests as well as burst, direct shear tests or bend tests enable the determination of the bond strength. The packaging hermeticity is characterized using mem ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
