|
Semiconductor Device Fabrication
Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as microprocessors, microcontrollers, and memories (such as Random-access memory, RAM and flash memory). It is a multiple-step Photolithography, photolithographic and physico-chemical process (with steps such as thermal oxidation, thin-film deposition, ion-implantation, etching) during which electronic circuits are gradually created on a wafer (electronics), wafer, typically made of pure single-crystal semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications. This article focuses on the manufacture of integrated circuits, however steps such as etching and photolithography can be used to manufacture other devices such as LCD and OLED displays. The fabrication process is performed in highly specialized semiconductor fabrication plants, also called foundries or "fabs", with the cen ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
10 Nanometer
In semiconductor fabrication, the International Technology Roadmap for Semiconductors (ITRS) defines the "10 nanometer process" as the MOSFET technology node following the "14 nm" node. Since at least 1997, "process nodes" have been named purely on a marketing basis, and have no relation to the dimensions on the integrated circuit; neither gate length, metal pitch or gate pitch on a "10nm" device is ten nanometers. For example, GlobalFoundries' " 7 nm" processes are dimensionally similar to Intel's "10 nm" process. TSMC and Samsung's "10 nm" processes are somewhere between Intel's "14 nm" and "10 nm" processes in transistor density. The transistor density (number of transistors per square millimetre) is more important than transistor size, since smaller transistors no longer necessarily mean improved performance, or an increase in the number of transistors. All production "10 nm" processes are based on FinFET (fin field-effect transistor) technol ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Nanometers
330px, Different lengths as in respect to the molecular scale. The nanometre (international spelling as used by the International Bureau of Weights and Measures; SI symbol: nm), or nanometer (American and British English spelling differences#-re, -er, American spelling), is a units of measurement, unit of length in the International System of Units (SI), equal to one billionth ( short scale) or one thousand million (long scale) of a meter (0.000000001 m) and to 1000 picometres. One nanometre can be expressed in scientific notation as 1 × 10−9 m and as m. History The nanometre was formerly known as the "''millimicrometre''" – or, more commonly, the "''millimicron''" for short – since it is of a micrometer. It was often denoted by the symbol ''mμ'' or, more rarely, as ''μμ'' (however, ''μμ'' should refer to a ''millionth'' of a micron). Etymology The name combines the SI prefix ''nano-'' (from the Ancient Greek , ', "dwarf") with the ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Semiconductor Industry Association
The Semiconductor Industry Association (SIA) is a trade association and lobbying group founded in 1977 that represents the United States semiconductor industry. It is located in Washington, D.C. About The Semiconductor Industry Association (SIA) positions itself as the voice of the U.S. semiconductor industry. This is one of America's top export industries and a driver of American economic strength, national security and global competitiveness. Founded in 1977 by five microelectronics pioneers Wilfred Corrigan of Fairchild Semiconductor, Robert Noyce of Intel Corporation, Jerry Sanders of Advanced Micro Devices, Charles Sporck of National Semiconductor Corporation and John Welty of Motorola, SIA unites companies that account for 80 percent of America’s semiconductor production. Through this coalition, SIA seeks to strengthen US leadership of semiconductor design and manufacturing by working with Congress, the Administration and other key industry stakeholders to encoura ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
CHMOS
CHMOS refers to one of a series of Intel CMOS processes developed from their Depletion-load NMOS logic#The HMOS processes, HMOS process. CHMOS stands for "complementary high-performance metal-oxide-silicon. It was first developed in 1981. CHMOS was used in the Intel 80C51BH, a new version of their standard MCS-51 microcontroller. The chip was also used in later versions of Intel 8086, and the 80C88, which were fully static version of the Intel 8088. The Intel 80386 was made in 1.5 μm process, 1.5 μm CHMOS III, and later in 1.0 μm CHMOS IV. CHMOS III used 1.5 micron Photolithography, lithography, p-well processing, n-well processing, and two layers of metal. CHMOS III-E was used for the 12.5 MHz Intel 80C186 microprocessor. This technology uses 1 μm process for the EPROM. CHMOS IV (H stands for High Speed) used 1.0 μm lithography. Many versions of the Intel 80486 were made in 1.0 μm CHMOS IV. Intel uses this technology on these 80C186EB and 80C188E ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
HMOS
In integrated circuits, depletion-load NMOS is a form of digital logic family that uses only a single power supply voltage, unlike earlier NMOS (n-type metal-oxide semiconductor) logic families that needed multiple power supply voltages. Although manufacturing these integrated circuits required additional processing steps, improved switching speed and the elimination of the extra power supply made this logic family the preferred choice for many microprocessors and other logic elements. Depletion-mode n-type MOSFETs as load transistors allow single voltage operation and achieve greater speed than possible with enhancement-load devices alone. This is partly because the depletion-mode MOSFETs can be a better current source approximation than the simpler enhancement-mode transistor can, especially when no extra voltage is available (one of the reasons early PMOS and NMOS chips demanded several voltages). The inclusion of depletion-mode NMOS transistors in the manufacturing proc ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Die Shrink
The term die shrink (sometimes optical shrink or process shrink) refers to the List of semiconductor scale examples, scaling of metal–oxide–semiconductor (MOS) devices. The act of shrinking a Die (integrated circuit), die creates a somewhat identical circuit using a more advanced fabrication process, usually involving an advance of lithographic semiconductor node, nodes. This reduces overall costs for a chip company, as the absence of major architectural changes to the Central processing unit, processor lowers research and development costs while at the same time allowing more processor dies to be manufactured on the same piece of silicon wafer, resulting in less cost per product sold. Die shrinks are the key to lower prices and higher performance at Semiconductor company, semiconductor companies such as Samsung Electronics, Samsung, Intel, TSMC, and SK Hynix, and fabless manufacturers such as Advanced Micro Devices, AMD (including the former ATI Technologies, ATI), Nvidia, ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Lam Research
Lam Research Corporation is an American supplier of wafer-fabrication equipment and related services to the semiconductor industry. Its products are used primarily in front-end wafer processing, which involves the steps that create the active components of semiconductor devices (transistors, capacitors) and their wiring (interconnects). The company also builds equipment for back-end wafer-level packaging (WLP) and for related manufacturing markets such as for microelectromechanical systems (MEMS). Lam Research was founded in 1980 by David K. Lam and is headquartered in Fremont, California. As of 2023, it was the third largest manufacturer in the Bay Area, after Tesla and Intuitive Surgical. History Lam Research was founded in 1980 by David K. Lam, a Chinese-born engineer who had previously worked at Xerox, Hewlett-Packard, and Texas Instruments. It was while he was at Hewlett Packard that he saw the need for better plasma etching equipment, to keep up with the rapid mini ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Tokyo Electron
, or TEL, is a Japanese electronics and semiconductor company headquartered in Akasaka, Tokyo, Akasaka, Minato-ku, Tokyo, Japan. The company was founded as Tokyo Electron Laboratories, Inc. in 1963. TEL is best known as a supplier of equipment to semiconductor device fabrication, fabricate integrated circuits (IC), flat panel displays (FPD), and photovoltaic cells (PV). , or TED, is a subsidiary of TEL specializing in semiconductor devices, electronic components, and networking devices. As of 2011, TEL was the largest manufacturer of IC and FPD production equipment. Listed on the Nikkei 225, in 2024, Tokyo Electron had a market cap of US$114.6 billion, making it the third-most valuable company in Japan in terms of market cap, and the 12th ranked semiconductor-related company worldwide. Company history 1963-1979 On 11 November 1963 Tokyo Electron Laboratories Incorporated was founded by Tokuo Kubo and Toshio Kodaka, largely funded by Tokyo Broadcasting System (TBS), with a capita ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
Applied Materials
Applied Materials, Inc. is an American corporation that supplies equipment, services and software for the manufacture of semiconductor (integrated circuit) chips for electronics, flat panel displays for computers, smartphones, televisions, and solar products. The company also supplies equipment to produce coatings for flexible electronics, packaging and other applications. The company is headquartered in Santa Clara, California, and is the second largest supplier of semiconductor equipment in the world based on revenue behind Dutch company ASML. History Founded in 1967 by Michael A. McNeilly and others, Applied Materials went public in 1972 on the National Association of Securities Dealers Automated Quotations ( NASDAQ), a then-recently established stock exchange. In subsequent years, the company diversified, until James C. Morgan became CEO in 1976 and returned the company's focus to its core business of semiconductor manufacturing equipment. By 1978, sales increased by 17%. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
ASML Holding
ASML Holding N.V. (commonly shortened to ASML, originally standing for Advanced Semiconductor Materials Lithography) is a Netherlands, Dutch multinational corporation that specializes in the development and manufacturing of photolithography machines which are used to produce integrated circuit, integrated circuits. it is the largest supplier for the semiconductor industry and the sole supplier in the world of extreme ultraviolet lithography (EUVL) photolithography machines that are required to manufacture the most advanced chips. , ASML was the fourth most valuable company in Europe, and the second most valued European tech company, with a market capitalization of about US$264 billion. ASML was founded in 1984 as a joint venture between the Dutch technology companies Philips and ASM International. It became a fully independent corporation in 1995. ASML's corporate headquarters is in Veldhoven, Netherlands and is the location for research, development, manufacturing and assembly. ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
FOUP
FOUP (an acronym for front-opening unified pod or front-opening universal pod) is a specialized plastic carrier designed to hold silicon Silicon is a chemical element; it has symbol Si and atomic number 14. It is a hard, brittle crystalline solid with a blue-grey metallic lustre, and is a tetravalent metalloid (sometimes considered a non-metal) and semiconductor. It is a membe ... wafers securely and safely in a controlled environment, and to allow the wafers to be transferred between machines for processing or measurement. FOUPs began to appear along with the first 300mm wafer processing tools in the mid 1990s. The size of the wafers and their comparative lack of rigidity meant that SMIF pods were not a viable form factor. FOUP standards were developed by SEMI and SEMI members to ensure that FOUPs and all equipment that interacts with FOUPs work together seamlessly. Transitioning from a SMIF pod to a FOUP design, the removable cassette used to hold wafers was replaced by ... [...More Info...] [...Related Items...] OR: [Wikipedia] [Google] [Baidu] |
